Agilent Adapter Rework

Introduction

Completed BGA placement onto probe.

Circuit Technology Center and Agilent Technologies have teamed up to provide the test world with a complete turn-key approach for testing DIMMS directly at BGA component site.

Agilent’s newly developed W2630A series DDR2 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with the Agilent logic analyzers and oscilloscopes.  Although this dynamic new product is available to support Engineers through the test process it does take some skillful attention to get installed for operation.

Circuit Technology Center, a world leader in circuit board rework and repair is a key service provider to Agilent and their customers with our “surgeon grade rework and repair services.”  Our full range of services include prepping and installing the DDR2 BGA probes onto circuit boards.

This procedure provides an overview of the process for installing Agilent DDR2 DRAM BGA Probes onto circuit board assemblies. Additional information is available at the Agilent web-site and on the product data sheet.

Operator Skills
The DDR2 BGA Probe installation is a challenging process to complete. The engineer or operator must have BGA rework experience. Reballing of the DDR2 BGA Probe is required for placement onto the circuit board. This process also requires experience and skill.

Equipment

• BGA reballing kit or system for component and probe solder ball attachment.
• Solder paste stencil for circuit board site preparation.
• Hot gas rework station designed for BGA component rework.
• Microscope with oblique view for perimeter inspection.
• X-ray inspection system for post placement inspection.

Initial removal of BGA component.

Step 1: BGA removal from circuit board
The process for safe removal of the BGA component is completed with a Hot Gas Rework Station. The circuit board may require additional preparation such as baking and masking the area off adjacent to the rework site.

To prevent damage the temperature of the circuit board and component must be closely monitored with thermocouples during the removal cycle.

Step 2: Circuit board site cleaning

Small corner section of BGA site prior to removal of residual solder.

After the component has been safely removed from the circuit board the component and site must be prepared for placement of the probe and placement of the BGA onto the Probe.

Circuit board and component site cleaning is completed with vacuum de-soldering nozzle that removes all residual solder from the sites.

Step 3: Solder ball application to Probe and component
The placement of solder balls on the probe, and re-balling the BGA component must be completed prior to placement on the circuit board. For this process a specially designed tool for re-balling is used along with specific stencils and solder balls to match the layout of the probe and BGA component.

Probe place onto circuit board assembly.

Step 4: Placement of Probe onto circuit board
Installation of the Probe onto the circuit board is completed with Hot Gas Rework System. Solder paste must be applied to the site prior to placement of the Probe. This process is completed with a solder stencil.

The application of heat is controlled by using a repeatable temperature profile that is unique for each circuit board.

Step 5: Placement of BGA onto the Probe
Installation of the BGA onto the Probe is also completed with Hot Gas Rework System and is very similar to the Probe placement.

Completed BGA placement onto probe.

The application of heat is controlled by using a repeatable temperature profile. Solder paste must be applied to the site prior to placement of the Probe. This process is completed with a solder stencil.

Step 6: Inspection to confirm soldering process
Like any BGA application the process to inspect the solder joints requires x-ray.

X-ray of the Probe interface to the circuit board and the BGA component to the Probe is required to inspect for solder bridges, voids and misalignment. §Perimeter inspection can be completed with a microscope or inspection camera.

Rework Charges
Approximate charges for this rework application are listed in the table below. An exact charge is quoted upon confirmation of the specific project requirements.

Code	General Description	Procedures	Price/Component
QP	BGA Rework Profile Development	9.2.1, 9.2.2	$150.00 - $250.00
Q1	BGA Component Rework, Removal Only	9.3.1	$60.00
Q2	Agilent Adapter Installation	9.3.1	$90.00 - $110.00
Q3	BGA Component Installation	9.3.1	$90.00 - $110.00
Q4	BGA Component Reballing	9.4.1	$40.00 - $90.00
QX1	BGA X-Ray Services	9.1.2	$25.00 - $60.00

Procedure for Getting Rework Performed
Follow the steps listed below to send circuit board(s) and the Agilent Adapter Probes to us for contract work.

1. Clearly identify the location(s) on your circuit board(s) that you would like the Agilent Adapter Probe installed. Use inspection arrows or include detailed printed instructions. Note: Include a copy of the component data sheet (dimensional drawing, ball count, spacing, layout). Use the form below to include electronic information.
2. Complete the form below. A copy of the form will automatically be sent by email to the person completing the form.
3. Properly package your circuit board(s) and Agilent Adapter Probe and ship them to:
   Circuit Technology Center, Inc.
   135 Ward Hill Avenue, Haverhill, MA 01835 USA
   Please be sure to:
    - Print your Purchase Order Number or Requisition Order Number clearly on the package.
   - Complete the Order Tracking Form using the form below and include it in your shipment.
4. After we receive and evaluate your circuit board(s) we will email a price and delivery quote to the Contact person listed on the form below. We will await your authorization prior to completing any work.
5. Upon completion, your circuit board(s) will be inspected, packaged, and safely shipped back to you.

For additional information call us at 978-374-5000. Our normal business hours are Monday - Friday 8:00 AM to 4:00 PM Eastern Standard Time. Please review our Prices, Terms, and Delivery Information for additional information.



Several members of the Circuit Technology Center team contributed to this feature story.

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