Salvaging and Refinishing Electronic Components

Executive Summary

As electronic components face increasing lead times, obsolescence, and cost pressures, salvaging and refinishing components from populated circuit boards has become a critical strategy for manufacturers, OEMs, and repair depots. When performed correctly, component salvage followed by controlled refinishing—such as robotic hot solder dip or reballing—can restore components to a condition suitable for reliable redeployment.

This white paper outlines the critical technical steps required to successfully salvage components from printed circuit boards (PCBs) and refinish them for reuse. It also highlights how Circuit Technology Center (CTC) performs these processes entirely in-house, ensuring quality control, traceability, and reduced turnaround times.

Why Component Salvage Matters

Component salvage is no longer a last-resort option. It is increasingly used to:

• Mitigate supply chain shortages and long lead times
• Recover obsolete or end-of-life components
• Reduce scrap and material costs
• Support sustainment of legacy systems

However, improper removal or refinishing can permanently damage a component or introduce latent reliability risks. A disciplined, process-driven approach is essential.

Step 1: Initial Assessment and Feasibility Analysis

Before any physical work begins, the component and board must be evaluated to determine salvage viability.

Key considerations include:

• Component type and package (BGA, LGA, QFN, leaded devices, etc.)
• Original solder alloy and RoHS status
• Presence of underfill, staking, or edge bonding
• Thermal history and board construction
• End-use requirements (commercial, industrial, aerospace, defense)

At CTC, this assessment is performed by experienced engineers and technicians to ensure the salvage process will not compromise the component’s electrical or mechanical integrity.

Step 2: Controlled Component Removal

Safe removal is one of the most critical steps in the salvage process. Excessive heat, poor thermal profiling, or mechanical stress can lead to:

• Die cracking
• Internal delamination
• Pad or ball damage
• Latent failures

Best Practices for Removal

• Precision rework systems with closed-loop thermal control
• Custom thermal profiles tailored to the specific package and board
• Bottom-side board support to prevent warpage
• Specialized techniques for underfilled or high-mass components

CTC utilizes advanced rework equipment and proprietary techniques—including cold precision milling when required—to safely remove even the most challenging components.

Step 3: Residual Solder and Contaminant Removal

Once removed, the component must be cleaned of all residual solder, flux, and contaminants without damaging pads, terminations, or substrates.

This step may include:

• Controlled solder removal processes
• Chemical and mechanical cleaning methods
• Microscopic inspection to verify pad integrity

Improper cleaning can lead to uneven solder surfaces, poor wetting, or reliability issues during reattachment.

Step 4: Inspection and Quality Verification

Before refinishing, the salvaged component undergoes detailed inspection to confirm it is suitable for reuse.

Inspection methods may include:

• High-magnification visual inspection
• X-ray analysis (for area array devices)
• Dimensional and coplanarity checks 

Only components that meet strict acceptance criteria proceed to refinishing.

Step 5: Refinishing Options

Depending on component type and application requirements, refinishing typically falls into one of two categories: robotic hot solder dip or reballing.

Robotic Hot Solder Dip (RHSD)

Robotic hot solder dip is commonly used for leaded components and is an effective method for:

• Removing tin whiskers
• Restoring solderability
• Converting lead-free finishes to SnPb where allowed

Key advantages of RHSD include:

• Highly repeatable, automated process control
• Uniform solder coating thickness
• Compliance with industry standards such as GEIA-STD-0006

CTC performs robotic hot solder dip in-house, providing full process traceability and consistency.

Reballing

Reballing is used primarily for BGA and LGA components where solder balls must be fully replaced.

The reballing process includes:

• Precise ball site preparation
• Placement of new solder spheres to the correct alloy, size, and pitch
• Controlled reflow using validated profiles

CTC supports a wide range of ball sizes and alloys, including SnPb and lead-free options, all performed internally to ensure tight quality control.

Step 6: Final Inspection, Testing, and Packaging

After refinishing, components undergo final inspection to verify workmanship and compliance.

This may include:

• X-ray inspection for ball integrity and voiding
• Visual and dimensional verification
• Electrical testing (when applicable)

Components are then properly packaged—often in dry-pack or ESD-safe materials—to preserve solderability and meet handling requirements.

The Advantage of In-House Capabilities at CTC

Performing component salvage and refinishing entirely in-house provides significant advantages:

• Reduced risk from multiple handoffs
• Shorter lead times
• Direct accountability for quality
• Ability to tailor processes to unique applications

Circuit Technology Center combines decades of rework expertise with advanced equipment to deliver reliable, repeatable component salvage and refinishing services under one roof.

When executed with precision and discipline, salvaging and refinishing electronic components is a powerful tool for overcoming supply chain challenges and extending product lifecycles. Success depends on careful assessment, controlled removal, thorough cleaning, and proven refinishing processes.

With in-house robotic hot solder dip and reballing capabilities, Circuit Technology Center provides a trusted, end-to-end solution for component salvage—helping customers reduce risk, control costs, and keep critical systems operational.