Technical Paper Details Essential Practices for Gold Mitigation of Electronic Components

Technical Paper Details Essential Practices for Gold Mitigation of Electronic Components

August 4, 2022

Gold plating removal from the solderable surfaces of electronic components is required for many electronic components due to gold embrittlement concerns. The ideal method to facilitate the removal of gold plating from SMT and through-hole components is to use a robotic hot solder dipping (RHSD) process. This new technical paper by Circuit Technology Center discusses the key process steps of this highly specialized process.

See the full paper at: https://www.circuitrework.com/features/1063.html

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