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Component Rework

Removal and replacement of surface mount and through hole components is one of the most common rework processes performed on assembled circuit boards. Although commonplace and sometimes routine, today's component packages and board features present an array of difficult component rework challenges.

We have over 100 pieces of equipment from Pace, Metcal and OK Industries, Air-Vac, and Electrovert to meet most any surface mount, BGA, and through hole component rework need. Our trained and qualified technicians are ready to tackle your toughest rework projects.
  • We have the best equipment available to meet most any surface mount, BGA, and through hole component rework need. Our trained and qualified technicians are ready to tackle your toughest rework projects.
Refer to our Rework Procedures for detailed information.

Surface Mount Component Rework
We use a mix of convection and conduction techniques for surface mount component removal. Many factors are considered, but normally conduction methods are used to remove smaller components.

Convection techniques are commonly used to remove larger, more sensitive components. Point to point soldering methods are normally used to replace surface mount components.

Through Hole Component Rework
We use vacuum desoldering systems for small through hole removal projects. We call upon our Electrovert Solder Fountain Systems for demanding multi-lead rework projects. These systems take great skill and experience to operate, but for high pin count through hole component rework, these workhorses can't be beat for reliability and efficiency.

Component Salvage
We can salvage most components for reuse.
Purchase Order / Quote Request Form
To place your purchase order or quote request by phone call 978-374-5000. You may also place your purchase order or quote request using the form below.

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Related Guide Procedures

8.0 Component Rework Procedures
List of component removal and rewok procedures including removal of through hole components, removal of chip components, removal of J lead components and removal of gull wing components.
8.1.1 Component Removal, Through Hole Components, Vacuum Method
Procedure covers removal of through hole components on assembled circuit boards.
8.1.2 Component Removal, Through Hole Components, Solder Fountain Method
Procedure covers removal of through hole components on assembled circuit boards.
8.2.1 Component Removal, Surface Mount Chip Components, Forked Tip Method
Procedure covers removal of surface mount chip components on assembled circuit boards.
8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method
Procedure covers removal of surface mount chip components on assembled circuit boards.
8.3.1 Component Removal, Surface Mount J Lead Components, Conduction Method
Procedure covers removal of surface mount J lead components on assembled circuit boards.
8.3.2 Component Removal, Surface Mount J Lead Components, Hot Gas/Air Method
Procedure covers removal of surface mount J lead components on assembled circuit boards.
8.4.1 Component Removal, Surface Mount Gull Wing Components, Conduction Method
Procedure covers removal of surface mount gull wing components on assembled circuit boards.
 

Related Feature Articles

How to Use a Solder Fountain
A complicated, time-consuming procedure is transformed into a quick and easy fix. Rework departments regularly encounter large ...
Challenging Connector Rework
This project involved rework of large connectors. The challenge was complicated due to the need to avoid overheating many jumpers wires ...
Rework for Pad and Component Mismatch
It's a wonder pad to part size mismatch doesn't happen more often, considering the thousands and thousands of opportunities on ...
Solder Mask Rework at a BGA Site
What happens when a BGA socket is phased out, but the solder mask is not updated. Solder mask is not needed for sockets, but ...
How Reliable Is Your Rework?
Can you fix a broken corner on a circuit board reliably? Do you consider re-balling ball grid array (BGA) components to be a reliable ...
X-Ray Finds Shorts in Drilled Holes
Drilling boards in the post-production environment is tricky work. Certainly if the board is populated with components and ...
Review of Hot Air Component Rework
When surface-mount components started to take over, edging out through-hole components, a number of hot air-based rework systems ...
Tips and Tricks for Successful Rework
Although soldering is one of the oldest know joining techniques, manual or hand soldering is still a process highly dependent upon individual ...
Tips For Connector Removal and Replacement
Quickly removing and replacing a large multi-pin connector seems a daunting task, but it really isn't. Here's how it can be done ...
Potted QFP Rework Challenge
Ordinarily removal and replacement of a QFP is a straightforward rework project. In this case however, the boards were completely ...
Need more information?
Use the form on our Contact Us page, or give us a call at 978-374-5000.

BGA Component Reballing

Including BGA component reball service to replace lead-free solder balls with leaded solder balls for high-rel applications.

BGA Component Rework

Including BGA rework, BGA component x-ray services, repair of damaged BGA pads and repair of BGA solder mask damage.

BGA Component Site Modification

This ingenious modification procedure uses flat copper ribbon that fits under the BGA component to provide an electrical path for modification.

Base Board Repair and Rework

Including repair damaged circuit base board laminate, delamination, warp, hole damage, burns, and solder mask damage.

Circuitry and Plated Hole Repair

Including repair damage to conductors, circuitry and plated holes, plus repair of damaged plated holes with inner layer connections.

Coating and Marking Rework

Including removal or replacement of conformal coatings and solder mask, and repair of circuit board legend and markings.

Component Rework

Including removal and replacement of surface mount components, through hole components, connectors and many other component types.

Component Salvage

Includes removal and salvage of BGA components, surface mount components, connectors and many other component types.

Engineering Change Services

Including ECO, engineering changes, upgrades, modifications, jumper wires, circuit cuts, and other modification procedures.

Gold Edge Contact Plating

Including repair and replating of solder contaminated gold contacts, scratched gold contacts and worn gold contacts.

Inspection Services

Including BGA component and circuit board x-ray inspection services using high-end Dage inspection systems.

Keysight Technologies Adapter Rework

This page explains the process for installing Keysight Technologies DDR2 DRAM BGA Probes onto circuit boards.

Order Tracking Form

Form to send circuit boards to us for repair and rework.

Quote Request

Use this form to request a quote for circuit board repair, rework, modification services.

SMT/BGA Pad Repair

Including repair of damaged, lifted or missing surface mount pads, BGA pads, and BGA pads with with integral via connections.

Terms, Prices, and Delivery

Service terms, prices, and delivery information covering our circuit board repair and rework services.

Customer Comments
"We were struggling with BGA rework on four of our most complicated assemblies until we decided to send them to you. Your team has been awesome and you've come through on every project."
R.R. Oklahoma City, OK USA
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Circuit Technology Center, Inc.
22 Parkridge Road
Haverhill, MA 01835 USA
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