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SMT and Through Hole Component Rework

Removal and replacement of surface mount and through hole components is one of the most common rework processes performed on assembled circuit boards. Although commonplace and sometimes routine, today's component packages and board features present an array of difficult component rework challenges.

We have over 100 pieces of equipment from Pace, Metcal and OK Industries, Air-Vac, and Electrovert to meet most any surface mount, BGA, and through hole component rework need. Our trained and qualified technicians are ready to tackle your toughest rework projects.
  • We have the best equipment available to meet most any surface mount, BGA, and through hole component rework need. Our trained and qualified technicians are ready to tackle your toughest rework projects.
Refer to our Rework Procedures for detailed information.

Surface Mount Component Rework
We use a mix of convection and conduction techniques for surface mount component removal. Many factors are considered, but normally conduction methods are used to remove smaller components.

Convection techniques are commonly used to remove larger, more sensitive components. Point to point soldering methods are normally used to replace surface mount components.

Through Hole Component Rework
We use vacuum desoldering systems for small through hole removal projects. We call upon our Electrovert Solder Fountain Systems for demanding multi-lead rework projects. These systems take great skill and experience to operate, but for high pin count through hole component rework, these workhorses can't be beat for reliability and efficiency.

Component Salvage
We can salvage most components for reuse.
 

Related Guide Procedures

8.0 Component Rework Procedures
List of component removal and rewok procedures including removal of through hole components, removal of chip components, removal of J lead components and removal of gull wing components.
8.1.1 Component Removal, Through Hole Components, Vacuum Method
Procedure covers removal of through hole components on assembled circuit boards.
8.1.2 Component Removal, Through Hole Components, Solder Fountain Method
Procedure covers removal of through hole components on assembled circuit boards.
8.2.1 Component Removal, Surface Mount Chip Components, Forked Tip Method
Procedure covers removal of surface mount chip components on assembled circuit boards.
8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method
Procedure covers removal of surface mount chip components on assembled circuit boards.
8.3.1 Component Removal, Surface Mount J Lead Components, Conduction Method
Procedure covers removal of surface mount J lead components on assembled circuit boards.
8.3.2 Component Removal, Surface Mount J Lead Components, Hot Gas/Air Method
Procedure covers removal of surface mount J lead components on assembled circuit boards.
8.4.1 Component Removal, Surface Mount Gull Wing Components, Conduction Method
Procedure covers removal of surface mount gull wing components on assembled circuit boards.
 

Related Feature Articles

How to Use a Solder Fountain
A complicated, time-consuming procedure is transformed into a quick and easy fix. Rework departments regularly encounter large ...
Challenging Connector Rework
This project involved rework of large connectors. The challenge was complicated due to the need to avoid overheating many jumpers wires ...
Rework for Pad and Component Mismatch
It's a wonder pad to part size mismatch doesn't happen more often, considering the thousands and thousands of opportunities on ...
Solder Mask Rework at a BGA Site
What happens when a BGA socket is phased out, but the solder mask is not updated. Solder mask is not needed for sockets, but ...
How Reliable Is Your Rework?
Can you fix a broken corner on a circuit board reliably? Do you consider re-balling ball grid array (BGA) components to be a reliable ...
X-Ray Finds Shorts in Drilled Holes
Drilling boards in the post-production environment is tricky work. Certainly if the board is populated with components and ...
Review of Hot Air Component Rework
When surface-mount components started to take over, edging out through-hole components, a number of hot air-based rework systems ...
Tips and Tricks for Successful Rework
Although soldering is one of the oldest know joining techniques, manual or hand soldering is still a process highly dependent upon individual ...
Tips For Connector Removal and Replacement
Quickly removing and replacing a large multi-pin connector seems a daunting task, but it really isn't. Here's how it can be done ...
Potted QFP Rework Challenge
Ordinarily removal and replacement of a QFP is a straightforward rework project. In this case however, the boards were completely ...
Need more information?
Use the form on our Contact Us page, or give us a call at 978-374-5000.
Customer Comments
"I just wanted to let you know, the 10 circuit boards that you touched up in the BGA area, all worked well. Thank you for your help. This is one happy customer."
G.C. Lowell, MA USA
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22 Parkridge Road
Haverhill, MA 01835 USA
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