Surface Mount and BGA Pad Repair

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Surface mount and BGA pad repair are routine operations performed daily at Circuit Technology Center. Damaged pads are replaced with specially fabricated, adhesive backed pads that are thermally bonded to the board surface.

This reliable IPC Recommended Procedure eliminates the need for using messy liquid epoxies to bond replacement pads in place. We stock thousands of different sizes and shapes of replacement pads.

Refer to the following procedures for detailed information.

• Surface Mount Pad Repair, Film Adhesive Method
• Surface Mount, BGA Pad Repair, Film Adhesive Method

SMT pad repair using the IPC recommended method.

Typical damaged surface mount pads.

For prices on surface mount pad repair go to: Service Charges.