At Circuit Technology Center, surface mount and BGA pad repairs are conducted daily using a proven, IPC-recommended procedure. Damaged pads are replaced with precision-fabricated, dry-film adhesive-backed pads that are thermally bonded to the PCB surface - eliminating the need for messy liquid epoxies and ensuring long-term reliability.
We maintain an extensive inventory of replacement pads in thousands of sizes and shapes to accommodate virtually any board design. This expertly controlled repair process ensures a durable, functional pad restoration while maintaining the structural and electrical reliability demanded by today's complex circuit designs in compliance with industry standards.
Key Highlights
- Performing SMT pad repairs using IPC-recommended methods since 1986
- The most experienced and qualified technicians worldwide
- Surface-mount pad repairs performed daily
- Ongoing technician training and skills reinforcement
- Many repair and rework materials have in-house fabrication control
- 10 calibrated systems for precision pad replacement
- Active role in industry standards development.
Technical Specifications
- Replacement materials include pads, lands, conductors, and other copper patterns
- Standard replacement materials are fabricated from 1 oz. copper foil
- Standard replacement materials are plated with lead-free or leaded solder
- Replacement materials have a dry-film thermoset adhesive backing
- Replacement materials are bonded using specially designed bonding systems
Compliance / References
- 4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method
- 4.4.2 Lifted Land Repair, Film Adhesive Method
- 4.5.2 Land Repair, Film Adhesive Method
- 4.6.2 Edge Contact Repair, Film Adhesive Method
- 4.7.2 Land Repair, Film Adhesive Method
- 4.7.3 Surface Mount, BGA Pad Repair, Film Adhesive Method
- IPC-7711/7721 Rework, Modification, and Repair of Electronic Assemblies
- IPC-A-610 Acceptability of Electronic Assemblies
- IPC-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies
- IPC-J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
- IPC-JEDEC-J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
- IPC-JEDEC-J-STD-033 Handling, Packing, Shipping, and Use of Moisture, Reflow, and Process Sensitive Devices
- IPC-7095 Design and Assembly Process Implementation for BGAs
- JESD625C.01 Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices
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