Our high-reliability BGA Reballing service can quickly rework BGA components that require reballing. Reballing is most often required after salvage, rework, or when the alloy of the BGA component solder balls needs to be changed from lead-free to leaded. Every BGA component rework project is completed to your exact specifications.
Touchless BGA component deballing process.
We use reliable, repeatable, and industry-wide proven processes to reball BGA components in compliance with JEDEC specifications. Small projects are completed using special BGA reball mini-ovens. A reflow oven is used on larger projects.
Reballed LGA component.
We use reliable, repeatable, and industry-wide proven processes to rework BGA components in compliance with IPC and JEDEC specifications.
We can perform ball-attach to LGA and QFN devices. BGA component reballing services are available for BGA components with 0.4mm pitch and up.
Post reball verification and inspection services include shear testing, XRF alloy verification, visual inspection to confirm sphere condition, ball alignment, size and location, x-ray inspection for excessive voiding and component marking using thermally printed labels or laser marking.
In addition to BGA component reballing, we have 5 top-line Air-Vac BGA rework systems and a fully trained staff of engineers and operators to support your BGA component rework needs.
A reflow oven is used on larger projects.
combination of BGA component reballing services and BGA component rework services provides you with a single source to meet project demands and tight schedules while meeting the highest quality standards. We're recognized as an industry leader in BGA services and have been qualified by companies around the world.
Whether you have one board or one thousand boards for rework, we're the company to turn to for BGA rework and reballing services. BGA reballing and rework is a challenge, but not for the experts at Circuit Technology Center. All projects are completed in our modern, fully compliant facility.