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BGA Component Reballing

Our high-reliability BGA Reballing service can quickly rework BGA components that require reballing. Reballing is most often required after salvage, rework, or when the alloy of the BGA component solder balls needs to be changed from lead-free to leaded. Every BGA component rework project is completed to your exact specifications.
  • We use reliable, repeatable, and industry-wide proven processes to reball BGA components in compliance with JEDEC specifications. Small projects are completed using special BGA reball mini-ovens. A reflow oven is used on larger projects.
BGA Component Reballing
Reballed LGA component.
We use reliable, repeatable, and industry-wide proven processes to rework BGA components in compliance with IPC and JEDEC specifications.

We can perform ball-attach to LGA and QFN devices. BGA component reballing services are available for BGA components with 0.4mm pitch and up.

Post reball verification and inspection services include shear testing, XRF alloy verification, visual inspection to confirm sphere condition, ball alignment, size and location, x-ray inspection for excessive voiding and component marking using thermally printed labels or laser marking.

In addition to BGA component reballing, we have 5 top-line Air-Vac BGA rework systems and a fully trained staff of engineers and operators to support your BGA component rework needs.

This
BGA Component Reballing
A reflow oven is used on larger projects.
combination of BGA component reballing services and BGA component rework services provides you with a single source to meet project demands and tight schedules while meeting the highest quality standards. We're recognized as an industry leader in BGA services and have been qualified by companies around the world.

Whether you have one board or one thousand boards for rework, we're the company to turn to for BGA rework and reballing services. BGA reballing and rework is a challenge, but not for the experts at Circuit Technology Center. All projects are completed in our modern, fully compliant facility.
 

Related Guide Procedures

9.0 BGA Component Rework Procedures
List of procedures covering BGA component rework on assembled circuit boards.
9.4.1 BGA Component Reballing, Fixture Method
Procedure covers steps involved in BGA component rework on assembled circuit boards.
 

Related Feature Articles

6 Common Mistakes of BGA Rework
Procedures for BGA rework are well-defined and long established, but there are six common mistakes. These mistakes can be costly leading ...
Tips for Rework of Large Scale BGA Components
You've just been given a board with a shorted BGA site. BGA rework is complicated enough, but in this case the challenge is ...
3 Options for BGA Rework
No matter how much we attempt to streamline and automate the process, BGA rework has been, and will likely always be, a mixture of ...
Preventing BGA Component Warp During Rework
This article deals the occasional tendency of larger (and thinner) BGA components to warp during rework causing bridging and shorts ...
 

Related Products

Flextac Rework Stencils
Flexible anti-static polymer film solder paste stencils with a residue-free adhesive backing.
201-3160 Heat Shield Kit
Kit includes tools and materials needed to protect heat sensitive area of a circuit board during rework.
Need more information?
Use the form on our Contact Us page, or give us a call at 978-374-5000.
Customer Comments
"I received the modified boards today (earlier than I expected) they tested fine. Nice job. I am amazed that you can do this type of work."
D.K. Plymouth, MI USA
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Circuit Technology Center, Inc.
22 Parkridge Road
Haverhill, MA 01835 USA
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