Gold edge contacts are essential for reliable connections in high-performance electronics but are prone to damage from solder contamination, plating wear, and dimensional issues. Circuit Technology Center specializes in restoring these contacts using IPC-recommended processes that ensure conductivity, durability, and mechanical integrity. Our technicians employ a proven brush plating method, utilizing meticulous surface preparation, selective masking, and controlled electroplating with high-purity gold. The result is a uniform finish meeting stringent thickness, hardness, and adhesion standards. We return contacts to like-new condition, ensuring reliable mating, optimal signal integrity, and long-term performance.
Key Highlights
- Specialists in restoring damaged gold edge contacts
- IPC-recommended brush plating process for reliable results
- Skilled technicians with decades of precision experience
- Proven surface preparation and selective masking methods
- Durable, uniform gold finish for extended lifecycle
- Trusted partner for aerospace, defense, and high-performance electronics
- Fully compliant with IPC 7711/7721 repair standards
Technical Specifications
- Restoration of gold edge contacts affected by solder, wear, or damage
- Brush plating process using high-purity gold
- Careful surface preparation and selective masking
- Controlled electroplating for precise finish application
- Meets stringent standards for thickness, hardness, and adhesion
- Restores conductivity, mechanical integrity, and signal performance
- IPC 7711/7721-compliant process for rework and repair
Compliance / References
- 4.6.3 Edge Contact Repair/Rework, Plating Method
- IPC-7711/7721 Rework, Modification, and Repair of Electronic Assemblies
- IPC-A-600 Acceptability of printed boards
- IPC-A-610 Acceptability of Electronic Assemblies
- IPC-J-STD-001 – Requirements for Soldered Electrical and Electronic Assemblies
- IPC-TM-650 TEST METHODS MANUAL (XRF)
- IPC-JEDEC-J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
- IPC-JEDEC-J-STD-033 Handling, Packing, Shipping, and Use of Moisture, Reflow, and Process Sensitive Devices
- ASTM B488 (International standard) Gold plating
- JESD625C.01 Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices
- MIL-DTL-45204 (Department of Defense) Gold plating
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