Surgeon grade rework and repair, by the book and guaranteed.®
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Phone: 978-374-5000

Base Board Repair and Rework

What happens to an assembled circuit board with a broken corner? Can it be repaired reliably? It certainly can if you have technicians who are trained and experienced at this expert level repair.

We can reliably repair nearly all types of base board defects including impact damage, burns, delamination, blistering, measling, warp, routing errors and more. We can also repair defects in coatings, solder mask and legend.

For most minor repairs, we use high strength, thermoset epoxy, blended with color agents to match surface colors and textures. We replace severely damaged base board material by bonding in replacement material using a tongue-and-groove joint.

For base board rework, engineering changes, and modifications we often use milling machines and precision drill systems to deliver high precision and close tolerances.

Many advanced base board repair and rework procedures were pioneered and perfected by Circuit Technology Center and are now included in IPC-7711/7721 Rework, Modification and Repair of Electronic Assemblies.

When you have valuable circuit board assemblies that require base board repair or rework, turn to Circuit Technology Center.
  • This image shows severe base material damage at a circuit board corner. A tongue-in-grove method is used for this type of complex repair. It may seem extreme, but is commonplace repair at Circuit Technology Center.
  • We evaluate the extent of the damage and determine the labor time and materials costs. We confirm to you the full cost before we proceed. Once you give us the approval, we schedule the work.
  • Step 1. We cut away the damaged board material using milling machine. We cut back to the point where all the damaged material is removed and there are no fibers of laminate material should be exposed.
  • Step 2. We machine a groove in the edge of the circuit board where the new base material will be installed. The groove is precisely centered in the edge to ensure that the new material will fit properly.
  • Step 3. We check the fit to be sure the new base material properly mates with the groove in the circuit board. Then mix epoxy, coat both the tongue and groove surfaces with the epoxy and fit the pieces together.
  • Step 4. After the epoxy has cured we saw or mill off excess base material to restore the proper profile. We check to ensure the circuit board conforms to the required dimensional configuration.
  • Step 5. We cut a piece of replacement base board material that is the same thicknessas the piece removed. We machine a tongue onto the entire mating edge of the replacement base material.
  • Step 6. We complete the repair by drilling holes, slots, etc. or adding circuitry as required. We also apply solder mask or coatings to restore the appearance.
  • Operations may include precision milling, drilling, cutting using either milling machines or precision bench-top drill systems.
  • Operations may include precision cutting and grinding using dental-style micro-drill systems.
  • This photo shows the repaired circuit board. This high conformance level repair follows documented IPC guidelines to ensure the repair is reliable and robust.
Purchase Order / Quote Request Form
To place your purchase order or quote request by phone call 978-374-5000. You may also place your purchase order or quote request using the form below.

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Related Guide Procedures

3.1 Delamination/Blister Repair, Injection Method
Procedures covering delamination and blister repair on circuit boards.
3.2 Bow and Twist Repair
Procedures covering bow and twist repair on circuit boards.
3.3.1 Hole Repair, Epoxy Method
Procedures covers repair of non-plated holes on circuit boards.
3.3.2 Hole Repair, Transplant Method
Procedures covers repair of non-plated holes on circuit boards.
3.4.1 Key and Slot Repair, Epoxy Method
Procedure covers repair of slots on circuit boards.
3.4.2 Key and Slot Repair, Transplant Method
Procedure covers repair of slots on circuit boards.
3.5.1 Base Material Repair, Epoxy Method
Procedure covers repair of damaged base board on circuit boards.
3.5.2 Base Material Repair, Area Transplant Method
Procedure covers repair of damaged base board on circuit boards.

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A Solution for Broken Pin Repair
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Related Products

201-3110 Base Board Repair Kit
Kit to repair base board and laminate damage on circuit boards.
115-1322 Circuit Bond Kit
Kit containing packages of clear, low viscosity, superior strength epoxy for circuit board damage repair.
201-2100 Professional Repair Kit
Kit to repair circuit board damage including pads, lands, conductors, base material and plated holes.
Need more information?
Use the form on our Contact Us page, or give us a call at 978-374-5000.

BGA Component Reballing

Including BGA component reball service to replace lead-free solder balls with leaded solder balls for high-rel applications.

BGA Component Rework

Including BGA rework, BGA component x-ray services, repair of damaged BGA pads and repair of BGA solder mask damage.

BGA Component Site Modification

This unique procedure uses copper ribbon that fits under the BGA component to provide an electrical path for modification.

Base Board Repair and Rework

Including repair damaged circuit base board laminate, delamination, warp, hole damage, burns, and solder mask damage.

Circuitry and Plated Hole Repair

Including repair of damage to circuitry and plated holes, plus repair of damaged plated holes with inner layer connections.

Coating and Marking Rework

Including rework of conformal coatings and solder mask, and repair of circuit board legend and markings.

Component Rework

Including removal or replacement of surface mount and through hole components, connectors and more.

Component Salvage

Includes removal and salvage of BGA components, surface mount components, connectors and many other component types.

Component Tinning Services

Our tinning or re-tinning services are used to change component leads and pads from one metallic finish to another.

Engineering Change Services

Including ECO, engineering changes, upgrades, modifications, jumper wires, circuit cuts, and other modification procedures.

Gold Edge Contact Plating

Including repair and replating of solder contaminated gold contacts, scratched gold contacts and worn gold contacts.

Inspection Services

Including BGA component and circuit board x-ray inspection services using high-end Dage inspection systems.

Keysight Technologies Adapter Rework

This page explains the process for installing Keysight Technologies DDR2 DRAM BGA Probes onto circuit boards.

Order Tracking Form

Form to send circuit boards to us for repair and rework.

Quote Request

Use this form to request a quote for circuit board repair, rework, modification services.

SMT/BGA Pad Repair

Including repair of damaged, lifted or missing surface mount pads, BGA pads, and BGA pads with with integral via connections.

Terms, Prices, and Delivery

Service terms, prices, and delivery information covering our circuit board repair and rework services.
Customer Comments
"Thanks for you and your recent work on my circuit board. When I slipped the board out of the box I was amazed at how meticulously it had been restored. And once the components were re-installed, it worked like a charm. I'll be recommending your services highly."
J.T. Austin, TX USA
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