| August 13, 2025
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There are many hot air-based component rework tools and machines available today. Many are large, some small, but all have various means of delivering hot air to the component with varying degrees of process control. While there are a few high-end, fully automatic systems, most are semi-automatic or manual. This article will focus on simple ...
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Why do wrinkles form on the surface of solder balls during reflow? This device uses Pb37Sn63 solder balls. Is this appearance acceptable for class 2 or class 3 products? Read what the panel of industry experts has to say.
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Circuit Technology Center has released updated procedures for electronic component reclamation, covering everything from leadless and radial-lead parts to BGAs. As circularity gains importance, the company leads efforts to extend component life through efficient, reliable reuse ...
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When a USB-C connector is forcibly removed from a circuit board, the damage often goes beyond a missing part. Given the fine pitch and mechanical stress involved, it's not uncommon for some of the tiny surface-mount pads beneath the connector to lift or tear off completely. That’s exactly what we encountered in a recent repair on a high-density circuit board...
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Due to tin-whisker mitigation concerns, re-balling BGA components from lead-free to tin-lead solder is a critical requirement by some high-reliability customer applications. This technical paper by Circuit Technology Center discusses the key process steps of this highly specialized process ...
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"It doesn't matter how much you scoot around the office in your swivel chair...you can't deduct it as business travel."
Copyright © Randy Glasbergen
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Trivia
What color does litmus paper turn if a solution is acidic?
See the answer below.
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Quote of the Week
"Leadership is the art of getting someone else to do something you want done because he wants to do it."
Dwight Eisenhower
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