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Circuit Technology Center provides comprehensive services for the precise removal and application of coatings, solder masks, and legends on circuit board surfaces. Whether driven by design revisions, manufacturing defects, or customer requirements, our experienced technicians modify board surfaces with accuracy and control. Using IPC-recommended methods, we safely remove or reapply coatings without compromising circuitry, even in high-density areas. From selective solder mask repair to legend and marking updates, our processes ensure boards meet original specifications or new requirements, supporting high-reliability applications across aerospace, defense, and advanced electronics industries.
Key Highlights
- Expertise in coating, solder mask, and legend modifications
- IPC-recommended processes ensuring safety and reliability
- Multiple removal methods tailored to coating type and location
- Selective application techniques matching thickness and durability
- Ability to repair or reapply solder masks for BGA sites and other critical areas
- Precision legend and marking modification for compliance and version control
- Trusted by leading industries for complex surface preparation and repairs
Technical Specifications
- Coating and solder mask removal methods:
* Controlled chemical stripping
* Micro-abrasion and micro-blasting
* Thermal and peeling techniques
* Precision scraping and grinding
- Selective solder mask application and repair with industry-approved materials
- Spot applications and full-area coating options
- Legend and marking removal, modification, and reapplication
- Updated text, symbols, or identification codes for regulatory compliance
- Processes designed for high-density and sensitive circuitry
- Compliance with IPC standards for rework, repair, and modification
Compliance / References
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