2.0 Basic Procedures

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2.1 Handling Electronic Assemblies

Properly handle circuit board assemblies to minimize ESD/EOS damage. Learn grounding, static-safe work areas, board/component edge handling, storage and contamination avoidance for reliable electronic assembly care.

2.2 Cleaning Procedures

Learn essential cleaning procedures for circuit boards and assemblies, covering both localized and aqueous batch methods to remove flux and contaminants that can impair soldering, performance, and reliability.

2.2.1 Cleaning, Local

Guide to localized cleaning of circuit boards and assemblies using solvent and brush techniques to remove surface contaminants that affect soldering and electrical performance in repair/rework operations.

2.2.2 Cleaning, Aqueous Batch Process

Aqueous batch cleaning procedure for circuit board assemblies, detailing water-based cleaning cycles, pressures, and rinse considerations to remove flux and contaminants while protecting sensitive components.

2.3.1 Coating Removal, Identification of Coating

Identify conformal coatings before removal to prevent substrate damage. Learn how to distinguish acrylic, urethane, silicone, epoxy and parylene coatings using visual inspection, solvent testing and practical field methods.

2.3.2 Coating Removal, Solvent Method

Remove conformal coatings using controlled solvent techniques that protect circuitry and base materials. Covers material compatibility, dwell time, application methods and safe removal practices for repair and rework.

2.3.3 Coating Removal, Peeling Method

Peel removable conformal coatings without damaging conductors or laminate. Step-by-step guidance for edge lifting, controlled removal and surface preparation to support reliable rework operations.

2.3.4 Coating Removal, Thermal Method

Use controlled heat to soften and remove conformal coatings in targeted repair areas. Learn proper temperature control, tooling selection and risk mitigation to prevent substrate damage during rework.

2.3.5 Coating Removal, Grinding/Scraping Method

Mechanically remove conformal coatings using precision grinding or scraping techniques. Includes tool selection, depth control and surface protection methods to avoid damage to traces and laminate.

2.3.6 Coating Removal, Micro Blasting Method

Micro blasting removes conformal coatings in precise areas using controlled abrasive media. Learn equipment setup, masking techniques and surface protection methods for accurate coating removal.

2.4.1 Coating Replacement, Solder Mask

Restore solder mask to protect circuitry and maintain electrical isolation. Covers surface preparation, mask application, curing and inspection practices for durable, professional repair results.

2.4.2 Coating Replacement, Conformal Coating, Encapsulant

Reapply conformal coating or encapsulant to protect repaired assemblies from moisture, contamination and electrical stress. Learn material selection, masking and controlled application methods.

2.4.3 Coating Replacement, Solder Mask, BGA Locations

Restore solder mask in BGA locations while maintaining pad geometry and spacing. Detailed procedures ensure insulation integrity and reliable component reinstallation in high-density areas.

2.5 Baking and Preheating

Use controlled baking and preheating to remove moisture and stabilize circuit boards before soldering or rework. Learn temperature guidelines and handling practices that reduce delamination and damage.

2.6.1 Legend/Marking Repair, Stamping Method

Restore board legends and identification markings using precision stamping techniques. Covers ink selection, alignment and curing practices to maintain traceability and professional appearance.

2.6.2 Legend/Marking Repair, Hand Lettering Method

Repair missing or damaged board markings using controlled hand lettering techniques. Includes surface preparation, ink selection and curing methods for durable, compliant identification.

2.6.3 Legend/Marking Repair, Stencil Method

Recreate board legends using stencil methods for consistent, repeatable marking repair. Learn stencil alignment, ink application and curing practices to maintain documentation integrity.

2.7 Epoxy Mixing and Handling

Properly mix and handle epoxy materials used in circuit board repair. Covers ratio control, pot life management, contamination prevention and curing practices to ensure structural reliability.

2.0 Basic Procedures

Overview of basic circuit board repair procedures including handling, cleaning, coating removal and material preparation. Establishes foundational practices for safe, controlled rework operations.