| September 22, 2020
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What industry standard applies to a pad/part size mismatch? Well, how's this for a mouthful, "IPC-J-STD-001D, Requirements for Soldered Electrical and Electronic Assemblies, Table 7-4, Dimensional Criteria- Chip Components - Rectangular or Square End Components". It's a wonder pad to part size mismatch doesn't happen more often. When it does happen, it's a big problem. Try as hard as we might ...
Feature Story
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We are struggling to solder and rework small parts - 0201s and 01005s. I have been using a small nozzle hot air solder rework station with adjustable air flow. The minimum air flow on the unit will blow small parts across ...
Ask the Experts
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Watch a short video that shows our robotic BGA component reballing capabilities. Our high-reliability BGA Reballing service can quickly rework BGA components that require reballing. Reballing is most often required when the alloy of the BGA component solder balls needs to be changed from lead-free to leaded. Every BGA Reballing project is completed to meet IPC and JEDEC specifications.
Learn more ...
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What can you do when you find solder mask covering some part of a circuit board where you don't want it. It's certainly not unusual to find test points, ground pads, or even a component footprint inadvertently covered with solder mask. But, all is not lost! There are several safe and reliable ...
Feature Story
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Australian researchers just successfully tested the world's fastest Internet communications speed. It used a single optical chip capable of downloading 1000 high-definition movies in a split second ...
Technology Briefing
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"Don't think of me as a 54 year old applicant. Think of it as getting two 27 year olds for the price of one!"
Copyright © Randy Glasbergen
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Trivia
With reference to electronic components, what does the acronym SOIC stand for?
See the answer below.
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Quote of the Week
"Everything that can be invented has been invented."
Charles H. Duell, Commissioner, U.S. Office of Patents, 1899
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