| October 20, 2025
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In most cases, the answer is no. BGA rework demands a unique blend of skill, experience, and finesse that not every operator possesses. Factors like manual dexterity, problem-solving ability, and even natural talent play significant roles in determining who can perform the job at the highest level. Assigning your most skilled operators to the most demanding BGA tasks is critical to success. While balancing fairness and morale among ...
Feature Story
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For calculating the life of moisture barrier bags used for long-term storage, I need to give the initial volume of the "vacuum-sealed" moisture barrier bag as input to one of my calculations. So, how do I calculate the volume of vacuum-sealed bag?
Ask the Experts
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Due to tin-whisker mitigation concerns, re-balling BGA components from lead-free to tin-lead solder is a critical requirement by some high-reliability customer applications. This technical paper by Circuit Technology Center discusses the key process steps of this highly specialized process.
FREE DOWNLOAD
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A customer once faced a costly problem - a pin snapped off at the base of an expensive pin grid array (PGA) component. The pin's shoulder was about twice the diameter of the main body and roughly 0.50" (12.7 mm) long. Could such damage be repaired? The repair needed to survive ...
Feature Story
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After reviewing the four AI use cases presented in this paper, it is very apparent that AI can have an overwhelming benefit with the AOI process and programs
Tech Paper
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"I want you to prepare a dynamic, intense, powerful, energy-charged Relaxation Workshop!"
Copyright © Randy Glasbergen
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Trivia
Who is widely given credit for accurately predicting the rapid growth in the processing power of integrated circuits?
See the answer below.
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Quote of the Week
"Most of the important things in the world have been accomplished by people who have kept on trying when there seemed to be no hope at all."
Dale Carnegie
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