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August 27, 2026 |
Via-in-pad designs can save valuable circuit board space, but filled vias can introduce unexpected problems during BGA rework. This feature examines how voids in via fill material reacted to reflow temperatures, causing board warpage, increased BGA voiding, and, in an extreme case, a solder ball to literally blow out.
Feature Story |
Damaged or contaminated circuit board edge contacts can often be restored without replacement. This detailed guide explains how selective swab plating can rebuild nickel and gold contact surfaces, covering solder removal, surface preparation, electrical buss connections, plating techniques, recommended voltage and timing settings, and final inspection procedures.
Guide of the Month |
Jumper wires may seem like simple circuit modifications, but improper routing and support can create serious long-term reliability problems. This technical paper examines how vibration-induced solder fractures caused intermittent field failures and explains how structured routing, height control, strain relief, bonding, and documentation significantly improved assembly reliability.
Case Study |
Selecting the correct eyelet is critical for a reliable plated through-hole repair. This blog explains the key dimensions technicians should consider, including component lead diameter, circuit board thickness, and drilled hole size, and provides practical selection criteria to ensure the eyelet fits properly and creates a secure, lasting repair.
Feature Story |
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Cartoon of the Day
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"I can complete the project under budget and ahead of schedule, but you'll need to allocate additional time and money for that."
Copyright © Randy Glasbergen
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Trivia
Which car did Ford produce in response to the popular Corvette?
See the answer below.
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Quote of the Week
"Heavier-than-air flying machines are impossible."
Lord Kelvin, President, Royal Society, 1895 |
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