When a military contractor needed to add 16 components to existing circuit boards, the original “dead bug” rework solution meant dozens of jumper wires and a messy assembly. This case study shows how precision copper foil patterns bonded directly to the PCB surface created a cleaner, more reliable, and production-friendly alternative that reduced labor while maintaining normal assembly processing.
Feature Story

This month's featured guide walks technicians through the precise process of repairing damaged surface-mount pads using adhesive-backed film pads. The procedure covers pad removal, surface preparation, alignment, bonding, solder connection, and final inspection techniques to achieve a durable, high-reliability repair that closely matches original. Ideal for advanced-level technicians performing SMT rework and circuit board repair.
Guide of the Month

Underfilled BGA components can turn standard rework into a high-risk operation with potential pad damage, delamination, and scrap. This technical paper explains how cold precision milling provides a controlled, low-thermal alternative for removing difficult underfilled devices, improving salvage rates, and reducing risk on high-value, high-reliability electronic assemblies.
Tech Paper

Circuit cuts may sound simple, but precision is everything when modifying or correcting PCB circuitry. This article explains the techniques, tools, and depth-control methods used to safely sever surface and internal conductors without damaging adjacent circuitry, including the use of X-ray targeting, micro-drills, and epoxy sealing for high-reliability rework.
Feature Story