Circuit Technology Center
Rework. Repair. Reclaim.
Knowledge, tips, and techniques from the leaders in advanced circuit board and component, rework, repair, and reclamation.
March 11, 2026
Rework for Pad and Component Mismatch
Rework for Pad and Component Mismatch
A pad-to-component size mismatch can occur when circuit board artwork errors create pads that do not properly match the intended surface-mount component footprint. In this case, a 1206 chip component was placed on a single elongated pad that was too narrow to meet IPC Class 3 solder joint width requirements. After evaluating alternatives, technicians replaced the incorrect pads with properly sized replacements using a surface-mount pad repair method. Over 60 pads were prepared, bonded, and restored, ensuring the assembly functioned correctly and met reliability requirements.
Feature Story
BGA Component Reball Inspection
BGA Component Reball Inspection
This guide describes the final inspection process for BGA component reballing to verify that solder spheres are properly formed, aligned, and securely attached before the component is reinstalled. Technicians inspect for defects such as crushed or missing spheres, oxidation, substrate damage, contamination, or misalignment. The procedure ensures the reballed component meets IPC and JEDEC requirements and is suitable for reliable use in high-reliability electronic assemblies.
Guide of the Month
Tech Paper: The Essential Guide for High-Reliability BGA Component Reballing
Tech Paper: The Essential Guide for High-Reliability BGA Component Reballing
Ball Grid Array (BGA) components often require reballing to restore reliable solder connections or convert lead-free packages to tin-lead alloys required in high-reliability electronics. This technical paper explains the complete process, including deballing, alloy conversion (such as SAC305 to Sn63Pb37), solder sphere replacement, alignment, and reflow. It highlights the use of robotic hot-solder-dip systems, as well as contamination control, inspection, and testing practices needed to ensure defect-free solder joints for aerospace, defense, and other mission-critical applications.

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Base Board Burn Repair - How and Why
Base Board Burn Repair - How and Why
Burn damage to a circuit board's base material can compromise both structural integrity and cosmetic appearance, potentially exposing laminate layers to moisture and contamination. This article explains how technicians remove charred material using precision milling tools, then restore the area with color-matched epoxy. The process rebuilds the laminate surface, protects internal layers, and returns the board to a reliable, professional condition without scrapping the assembly.
Feature Story
Cartoon of the Day
Cartoon
"I was going to get up early to go running, but my toes voted against me 10 to 1."
Copyright © Randy Glasbergen
Trivia
The transistor was invented by engineers at Bell Labs. What year was it invented?
See the answer below.
Quote of the Week
"If I have seen farther than other men, it is because I stood on the shoulders of giants."
Sir Isaac Newton
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Circuit Technology Center
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Haverhill, MA 01835 USA
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Contributors
Andy Price, Bob LePage, Brad Ferry, Brianna Anderson, Brooke Ferry, Bun Chhouy, Jessica Calabrese, Jim Rennick, Justin Camasso, Mark Bates, Matt Marchand, Matt Solt, Paul Pedroso, Peter Vigneau, Ronna LaBranche, Jeff Ferry

Since 1983 Circuit Technology Center and CircuitMedic have been recognized as the world's most innovative and reliable specialists in circuit board rework and repair services and products.

Trivia Answer
1947 by John Bardeen, William Shockley and Walter Brattain at Bell Labs and in 1956, they were awarded the Nobel Prize in Physics "for their researches on semiconductors and their discovery of the transistor effect".