| January 24, 2024
|
You have a new board, and the BGA component doesn't fit the board footprint. Is this a nightmare of a problem? We see it at Circuit Technology Center every other month or so. It seems to be a problem OEMs face early in the development cycle. In this actual example, the flagship product an OEM was working on reached the post-assembly test phase when they discovered a hang-up. The BGA that was loaded at several locations ...
Feature Story
|
What process do you recommend for removing oxidation from SMT components? These components are unsolderable due to the surface finish.
Ask the Experts
|
Due to tin-whisker mitigation concerns, re-balling BGA components from lead-free to tin-lead solder is a critical requirement by some high-reliability customer applications. This technical paper by Circuit Technology Center discusses the key process steps of this highly specialized process.
FREE DOWNLOAD
|
Performing cuts on external and internal connections can be simple or extremely complex. Quite often, a rework department is confronted with the task of cutting, rather than establishing, connections. Often called conductor cuts or circuit cuts, such procedures involve ...
Feature Story
|
Researchers demonstrated an energy-efficient method for transferring data over fiber-optic cables that connect computing nodes used to train AI.
Technology Briefing
|
 |
"My mom says I have to go inside to take a nap. That's the kind of over-regulation that is killing small business!"
Copyright © Randy Glasbergen
|
|
Trivia
In radio, what does AM and FM stand for?
See the answer below.
|
Quote of the Week
"The pure and simple truth is rarely pure and never simple."
Oscar Wilde
|
|
|
