| May 24, 2010
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This is an example of a recent project where the solution was more reliable, less labor intensive and much more elegant that the alternative... dead bugging. If you're not familiar with dead bugging it's when you need to add components to a circuit board and have no place to put them so you glue them upside-down and run jumper wires to complete the circuits. It's usually a big mess.
A military contractor had an engineering change to implement to a batch of circuit board that involves the addition of 16 components. The original solution was to dead-bug the components and adding 30 jumper wires to some lifted component leads and surface pads
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What do you do when a flash memory SD card containing photos of President George W. Bush and your client in the White House breaks into pieces, leaving you holding one of the tiny microchips you know full well should be inside?
The answer probably won't surprise you one bit: Take a deep breath and try to remain calm. This will provide you with no practical benefit. It will, however, afford you just enough time to really mull over how completely screwed you might be.
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Circuit Technology Center and Keysight Technologies have teamed up to provide the test world with a complete turn-key approach for testing DIMMS directly at BGA component site.
Keysight Technologies newly developed W2630A series DDR2 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with the Keysight Technologies logic analyzers and oscilloscopes. Although this dynamic new product is available to support Engineers through the test process it does take some skillful attention to get installed for operation.
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Trivia
See the answer below.
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Quote of the Week
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