| February 19, 2025
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This paper addresses the critical issue of component tinning, specifically focusing on its implementation and challenges. Authored by experts in the field, the paper provides valuable insights into the best practices and techniques required for successful lead tinning. As electronic components play a vital role in various industries, ensuring reliable and efficient tinning ...
Feature Story
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A lot of balls are observed after reflow process along and under SMD components. We have not found the root cause; any ideas are welcome.
Ask the Experts
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We’re excited to be exhibiting at IPC APEX this year! Visit our team at Booth #937 on the tradeshow floor and learn more about our latest innovations. Don't miss Jeff Ferry, President of Circuit Technology Center, as he presents "The Economics of Component Salvage and Reuse" during Session 6: Solder Processes & Reliability on March 18 at 2:00 PM. We look forward to connecting with you!
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Some time ago, we had the good fortune to obtain a Dage X-ray machine. We used an older machine that had been a reliable workhorse for years. Since we loved our old machine, we didn't immediately recognize what the Dage ...
Feature Story
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The electronics industry is approaching a limit to the number of transistors that can be packed onto the surface of a computer chip. So, chip manufacturers are looking to build up rather than out ...
Technology Briefing
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"I've outsourced my job to a dog overseas who will be your companion via web cam."
Copyright © Randy Glasbergen
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Trivia
What element has the lowest boiling point?
See the answer below.
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Quote of the Week
"A lot of people are afraid of heights. Not me; I'm afraid of widths."
Steven Wright
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