| November 8, 2017
|
You have a new board and the BGA component doesn't fit the board footprint. Is this a nightmare of a problem? It is one we see at Circuit Technology Center every other month or so. It's seems to be a problem faced by OEM's early in the development cycle. In this actual example the flagship product an OEM was working reached the post assembly test phase when they discovered a hang-up. The BGA that was loaded at several locations on the board was the wrong ...
Feature Story
|
We're experiencing problems with tacky flux residues under BGA components after rework. Upon removing the reworked part we notice a honey-like amber residue. We're not having functional failures, but have experienced failures after thermal cycling. Do you know what this residue is and how can we remove it from ...
Ask the Experts
|
This paper is an examination of the process feasibility, solder joint reliability, and materials/process compatibility of a dippable solder paste material for an area array component rework/repair process ...
Technical Library
|
After an epic effort to gain access to the White House, a pool photographer was able to take hundreds of photos and a few hi-res video clips of his clients and G.W. Bush. Later the Flash memory SD card that contained all the data snap to pieces in his hands. A really small, really important, $30 SD card ...
Feature Story
|
Currently, most parts of a smart phone are expensive and break easily. But with almost 1.5 billion smart phones purchased worldwide last year, manufacturers are on the lookout for something more durable and less ...
Technology Briefing
|
 |
"I'm cutting back your hours from 80 a week to 40. You get every other minute off."
Copyright © Randy Glasbergen
|
|
Trivia
What is the name of the meeting of industrial nations in 1987 that called for the elimination of ozone-depleting substances?
See the answer below.
|
Quote of the Week
"These, Gentlemen, are the opinions upon which I base my facts."
Winston Churchill
|
|
|
