| January 25, 2012
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Ball Grid Array rework is one of the most challenging procedures performed at assembly facilities and repair depots around the world. Doing it right depends in large part on the skills and knowledge of the rework technician. That's why we say that BGA rework is mostly science, with a big slice of art thrown in!
Procedures for BGA rework are well-defined and long established, but there are six common mistakes. These mistakes can be costly leading to excessive solder joint voiding, BGA pad damage during the BGA removal process, and incorrect BGA orientation or joint bridging. Click to watch and listen to our video covering this topic.
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Circuit Technology Center and Keysight Technologies have teamed up to provide the test world with a complete turn-key approach for testing DIMMS directly at BGA component sites.
Keysight Technologies W2630A series DDR2 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with the Keysight Technologies logic analyzers and oscilloscopes. Although this dynamic product is available to support Engineers through the test process, it does take some skillful attention to get installed.
This procedure provides an overview of the process for installing Keysight Technologies DDR2 DRAM BGA Probes onto circuit board assemblies.
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Drilling boards in the post-production environment is tricky work. Certainly if the circuit board is populated with components and other hardware, the setup alone can be time consuming. Additionally, datum points (the spots that ensure drilling precision) are not always easy to calibrate because these points are often designed for electronic versus mechanical location.
Things get dicey when the drilling occurs at a location where internal planes project into the newly drilled hole, especially when the planes are separated by 12, 10, 5, or even 2 thousandths of an inch. And sometimes there are a dozen or more planes stacked all the way through the height of the hole.
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Trivia
See the answer below.
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Quote of the Week
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