| January 26, 2011
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Imagine being confronted by this challenge? You've just been given a board with a shorted BGA component. If management decides the board is worth salvaging, there's only one thing to do; remove the BGA component, clean the site, and replace the BGA.
You've done this many times before, BGA rework at any level can be finicky and challenging.
Yes, it is complicated enough, but in this case the challenge is magnified as this BGA component has 2600 balls at 1.0 mm pitch ...
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Extra Strength! When it comes to circuit board repair, there are situations when extra strength becomes critical.
In this instance we're looking at the process to correct base board damage at an ejector handle location. The ejector handle is often held in place by a roll pin that is pressed into a non plated hole on the circuit board.
When the ejector handle is retracted it's lever action will be used to press in, or eject the circuit board. The ejector handle roll pin will put a sizable amount of stress inside the ejector handle mounting ...
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Generally, two options are available to confront problem gold edge contacts: replace the contact, or re-plate with gold. Both procedures result in a high conformance level repair that is reliable and long lasting.
Re-plating is a reliable, yet complicated, process requiring a considerable amount of setup, special chemistry that is hazardous and, a high level of operator skill and training.
Replacing the contact is faster and simpler, lacking the setup and chemistry of re-plating, but should only be used for low volumes, five or six contacts, or less, per ...
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Trivia
See the answer below.
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Quote of the Week
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