| August 24, 2011
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BGA rework is a topic about which volumes have been written, and in most cases the focus has been on component removal and replacement. However, equally important is the topic of BGA site modification, and the need for such modification arises often.
A common type of BGA site modification is the need to add a jumper wire at a BGA site. One option is to run a jumper through a hole in the board. This method is normally used for engineering changes and modifications.
This method is used when there is a buried via, and other methods of terminating to the opposite side are not an option. This method also requires a high degree of operator skill, as well as precision milling equipment. It's fairly complex, and must be done correctly to ensure ...
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Anyone familiar with high-frequency and microwave printed circuits understands the sensitive design considerations each requires. Occasionally, you may encounter the need to reduce a circuit or conductor width when a pad or conductor is violating space requirements.
This type of modification is an extremely delicate operation requiring not only the hands of a surgeon, but may require the use of customized tools modified specifically for the application.
Recently, we were presented with such a challenge. We were asked to remove a section of a pad to provide the specified separation of the pad from a conductor running close ...
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Manufacturers solder tens of thousands of BGA components every day. Most of this activity occurs in the flow of manufacturing and some during rework. Most BGA placement is performed flawlessly. On the other hand, industry's dynamic forces constantly push the envelope. Occasionally things go wrong.
It used to be that BGA pads were always routed out to a via on the same side of the board as the pad. Now more and more designers are trying to reclaim that space by using the BGA pad itself as a via.
There are occasions when the via in pad solution causes disruptions in BGA placement...
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