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Circuit Technology Center
Surgeon grade rework and repair, by the book and guaranteed.
6.0 Jumper Wire and Component Modification Procedures
Printed Board Type: N/A
Skill Level: N/A
Conformance Level: N/A
Revision: N/A
Revision Date: N/A
6.1 Jumper Wires
Procedure covers use of jumper wires
including 42 detailed illustrations and photographs.
6.2.1 Jumper Wires, BGA Components
Circuit Track Method
Procedure is used to change a circuit path at a
BGA site for engineering changes or modifications.
6.2.2 Jumper Wires, BGA Components
Through Board Method
Procedure is used to add a jumper at a BGA site by
running the jumper through a hole in the board.
6.3 Component Modifications and Additions
Procedure covers the general guidelines for
modifications that involve adding components.
6.4 Component Lead Cutting and Lifting
Procedure covers the general guidelines for
for modifications that involve cutting and lifting component leads.
Related Information
Base Board Repair and Rework
BGA Component Rework and Site Modification
Circuitry and Plated Hole Repair
Coating and Marking Rework
Engineering Changes including Jumper Wires
Gold Edge Contact Repair and Replating
SMT and BGA Pad Repair
SMT and Through Hole Component Rework
Before you consider the scrap barrel
Think about the impact on your bottom line
What happens to your valuable circuit boards when they're damaged? Can you repair them reliably? You might be surprised.
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Guide Book
0.0 Introduction
1.0 Foreword
2.0 Basic Procedures
3.0 Base Board Procedures
4.0 Conductor Procedures
5.0 Plated Hole Procedures
6.0 Wires/Component Mods
7.0 Soldering Procedures
8.0 Component Removal
9.0 BGA Comp. Rework
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