Circuit Technology Center
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6.0 Jumper Wire and Component Modification Procedures
6.1 Jumper Wires
6.1 Jumper Wires
Procedure covers use of jumper wires including dozens of detailed illustrations and photographs.
6.2.1 Jumper Wires, BGA Components, Circuit Track Method
6.2.1 Jumper Wires, BGA Components, Circuit Track Method
Procedure is used to change a circuit path at a BGA site for engineering changes or modifications.
6.2.2 Jumper Wires, BGA Components, Through Board Method
6.2.2 Jumper Wires, BGA Components, Through Board Method
Procedure is used to add a jumper at a BGA site by running the jumper through a hole in the circuit board.
6.3 Component Modifications and Additions
6.3  Component Modifications and Additions
Procedure covers the general guidelines for modifications that involve adding components.
6.4 Component Lead Cutting and Lifting
6.4 Component Lead Cutting and Lifting
Procedure covers the general guidelines for for modifications that involve cutting and lifting component leads.

This procedure is for reference only. Refer to the Procedure References listed above, or contact Circuit Technology Center for appropriate industry approved references.
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