6.1 Jumper Wires Procedure covers use of jumper wires including dozens of detailed illustrations and photographs.

6.2.1 Jumper Wires, BGA Components, Circuit Track Method Procedure is used to change a circuit path at a BGA site for engineering changes or modifications.

6.2.2 Jumper Wires, BGA Components, Through Board Method Procedure is used to add a jumper at a BGA site by running the jumper through a hole in the circuit board.

6.3  Component Modifications and Additions Procedure covers the general guidelines for modifications that involve adding components.

6.4 Component Lead Cutting and Lifting Procedure covers the general guidelines for for modifications that involve cutting and lifting component leads.

This procedure is for reference only. Refer to the Procedure References listed above, or contact Circuit Technology Center for appropriate industry approved references.

  Base Board Repair and Rework
  BGA Component Rework and Modification
  Circuitry and Plated Hole Repair
  Coating and Marking Rework
  Engineering Changes and Jumper Wires
  Gold Edge Contact Repair and Replating
  SMT and BGA Pad Repair
  SMT/Through Hole Component Rework