Including BGA component reball service to replace lead-free solder balls with leaded solder balls for high-rel applications.
Including BGA rework, BGA component x-ray services, repair of damaged BGA pads and solder mask damage.
This unique procedure uses copper ribbon that fits under the BGA component to provide an electrical path for modification.
Including repair damaged circuit base board laminate, delamination, warp, hole damage, burns, and solder mask damage.
Including repair of damage to circuitry and plated holes, plus repair of damaged plated holes with inner layer connections.
Including rework of conformal coatings and solder mask, and repair of circuit board legend and markings.
Component modification services by robotic hot solder dip (RHSD) for tin and gold mitigation applications
Including removal or replacement of surface mount and through hole components, connectors and more.
Includes removal and salvage of BGA and surface mount components, connectors and many other component types.
Our robotic hot solder dip (RHSD) component tinning services are used to change the metallic finish on the terminations of discreet SMT devices
Including engineering changes, upgrades, modifications, jumper wires, circuit cuts, and many other procedures.
Including repair and replating of solder contaminated gold contacts, scratched gold contacts and worn gold contacts.
Including BGA component and circuit board x-ray inspection services using high-end Dage inspection systems.
This page explains the process for installing Keysight Technologies DDR2 DRAM BGA Probes onto circuit boards.
Our robotic hot solder dip (RHSD) component tinning services are used to change the metallic finish on the pads of LGA devices
Form to send circuit boards to us for repair and rework.
Our robotic hot solder dip (RHSD) component tinning services are used to change the metallic finish of PLCC devices
Service prices, and delivery information covering our circuit board repair and rework services.
Our robotic hot solder dip (RHSD) component tinning services are used to change the metallic finish of QFP devices
Use this form to request a quote for circuit board repair, rework, modification services.
Including repair of damaged or missing surface mount pads, BGA pads, and BGA pads with with integral vias.
Our robotic hot solder dip (RHSD) component tinning services are used to change the metallic finish of SOIC devices
Our robotic hot solder dip (RHSD) component tinning services are used to change the metallic finish of SOT-23 devices
Our robotic hot solder dip (RHSD) component tinning services are used to change the metallic finish on the leads of through hole connectors
