| January 21, 2021
|
Manufacturers solder tens of thousands of BGA components every day. Most of this activity occurs in the flow of manufacturing and some during rework. Most BGA placement is performed flawlessly. On the other hand, industry's dynamic forces constantly push the envelope. Occasionally things go wrong. It used to be that BGA pads were always routed out to a via on the same side of the board as the pad. Now more and more designers are trying to reclaim that space by using the BGA pad itself as a via ...
Feature Story
|
We are building small lots of circuit board assemblies using no-clean solder paste. We are getting a white residue on the boards. What would you suggest is the best way to clean small lots of circuit board assemblies that were assembled using no-clean ...
Ask the Experts
|
Our high-reliability BGA Reballing service can quickly rework BGA components that require reballing.
Every BGA Reballing project is completed to meet IPC and JEDEC specifications.
Watch Our 1 Minute Start to Finish Video
|
Can you fix a broken corner on a circuit board reliably? Do you consider re-balling ball grid array (BGA) components to be a reliable procedure? Should you attempt to repair a damaged plated hole with an inner layer connection? Your opinion and experiences with issues ...
Feature Story
|
Quantum computing research is still in "the vacuum-tube era," but several companies are demonstrating very rudimentary "quantum supremacy." These technologies are now reaching a level of maturity where we'll start seeing "accelerating returns" kick ...
Technology Briefing
|
 |
"We need to make room for the new hires. We're moving you to the cloud."
Copyright © Randy Glasbergen
|
|
Trivia
What color on black produces the most visible combination?
See the answer below.
|
Quote of the Week
"The secret of getting ahead is getting started."
Mark Twain
|
|
|
