| December 10, 2020
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You have a new board and the BGA component doesn't fit the board footprint. Is this a nightmare of a problem? It is one we see at Circuit Technology Center every other month or so. It's seems to be a problem faced by OEM's early in the development cycle. In this actual example the flagship product an OEM was working reached the post assembly test phase when they discovered a hang-up. The BGA that was loaded at several locations on the board was the wrong one! To further complicate matters, the footprint of the ...
Feature Story
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I am requesting a no-clean solder-paste process because of the inability to adequately clean a water-clean flux from under several leadless ICs and transistors. Are my fears about properly cleaning water-clean flux from under low-profile parts justified ...
Ask the Experts
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Our high-reliability BGA Reballing service can quickly rework BGA components that require reballing.
Every BGA Reballing project is completed to meet IPC and JEDEC specifications.
Watch Our 1 Minute Start to Finish Video
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Soldering to gold has never been a flawless exercise. Concerns about the quality and quantity of gold finishes buzz around the soldering process like annoying horseflies, drawing blood whenever your guard is dropped. Soldering gold connecter pins into through holes can shackle us ...
Feature Story
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MIT engineers have developed a representation of spatial perception for robots that is modeled after the way humans perceive and navigate the world ...
Technology Briefing
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"I can't believe my boss is such an idiot. I thought he was brilliant when he hired me!"
Copyright © Randy Glasbergen
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Trivia
Which metal, in its purest form, has the highest melting point?
See the answer below.
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Quote of the Week
"Autumn is a season followed immediately by looking forward to spring."
Doug Larson
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