| November 17, 2021
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The type of warping addressed here can cause bridging and shorts at the outer corners of the device during replacement. This problem can require more rework at the BGA site, surely no fun at all. It's generally understood that some minor distortion occurs in BGA components and circuit boards when heated, due to the varying thermal coefficient of expansion (TCE) of all the different materials. In the BGA component, this effect is ...
Feature Story
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When our company purchased new soldering stations two years ago we were told that they do not require calibration. I believe that all soldering stations should be calibrated and re-calibrated after some point? Do you agree ...
Ask the Experts
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CircuitMedic has released an updated version of its popular Bonding System. The new Bonding System is specifically designed to bond replacement circuit patterns such as surface mount pads, BGA pads, and plated hole pads, to circuit boards. The Bonding System uses bonding tips to deliver a precise, calibrated pressure to activate and cure the dry film adhesive that is applied to the replacement circuit patterns.
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Circuit Technology Center and Keysight Technologies have teamed up to provide the test world with a complete turn-key approach for testing DIMMS directly at BGA component sites. Keysight Technologies W2630A series DDR2 BGA probes enable probing embedded memory DIMMs directly ...
Feature Story
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Assessing the timing and real-world impact of quantum computing has proven more difficult than for any of the other transformational technologies...
Technology Briefing
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"Some of us are concerned that your technology report contains language that could be offensive to our computers."
Copyright © Randy Glasbergen
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Trivia
What did Wilhelm Roentgen discover in 1895?
See the answer below.
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Quote of the Week
"Technology is dominated by two types of people: those who understand what they do not manage, and those who manage what they do not understand."
Putt's Law
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