New White Paper Discusses the Key Process Steps of High-Reliability BGA Re-Balling
|
March 17, 2022
The re-balling of BGA components from lead-free to tin-lead solder is a critical requirement by some high-reliability customer applications due to tin-whisker mitigation concerns. This new technical paper by Circuit Technology Center discusses the key process steps of this highly specialized process.
See the full paper at: https://www.circuitrework.com/features/1040.html
|
|
