Circuit Technology Center

Circuit Technology Center Doubles Component-Level Tinning Services Capacity

March 9, 2022

Circuit Technology Center Doubles Component-Level Tinning Services Capacity
Circuit Technology Center has four fully commissioned robotic hot solder dip (RHSD) machines to assist with high and low volume tin whisker mitigation.
Circuit Technology Center recently received and commissioned two additional Hentec Odyssey 1325 robotic hot solder dip (RHSD) machines. These new machines double the existing capacity to four machines to meet the increasing demand from the defense and high-reliability customer base that requires component level modification/alteration for tin whisker mitigation, gold mitigation, and lead re-conditioning. This state-of-the-art equipment is also used for automated and touch-less BGA component de-balling, required as part of converting BGA's with lead-free solder to tin-lead solder. All equipment and processes comply with stringent GEIA-STD-006, J-STD-001, and IEC TS 62647-4 standards.

The Odyssey 1325 systems are MIL-spec complaint, high-volume, high-mix component tinning machines featuring auto load/unload, multi-component pickup head, and dynamic solder wave. All process parameters are controlled, including immersion depths, dwell times, insertion and extraction speed, acceleration, solder pump speed, and temperatures.

"For nearly 40 years, leading defense and aerospace companies have relied on Circuit Technology Center as the world leader in circuit board level modification, rework and damage repair services," said Andy Price, Sales Manager. "We are thrilled to announce this capacity expansion, offering our defense and high-reliability customers component level modification and alteration services with the same exceptional quality and service that they have come to expect from our company."