Circuit Technology Center

Circuit Technology Center Defines New Procedure for Rework of BGA's Underfilled with Non-reworkable Underfill Epoxy

February 24, 2021

Circuit Technology Center is frequently tasked with the selective rework of BGA devices that have been underfilled with “non-reworkable” underfill epoxy. Traditional, established rework methods of using either hot gas or IR reflow technology cannot be used when non-reworkable underfills have been injected under BGA’s. Circuit Technology Center developed a reliable process to solve this challenging application and provided details in a new guidebook procedure.

For more information see the guidebook procedure at: