Circuit Technology Center Defines New Procedure for Rework of BGA's Underfilled with Non-reworkable Underfill Epoxy
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February 24, 2021
Circuit Technology Center is frequently tasked with the selective rework of BGA devices that have been underfilled with “non-reworkable” underfill epoxy. Traditional, established rework methods of using either hot gas or IR reflow technology cannot be used when non-reworkable underfills have been injected under BGA’s. Circuit Technology Center developed a reliable process to solve this challenging application and provided details in a new guidebook procedure.
For more information see the guidebook procedure at: www.circuitrework.com/guides/9-5-1.html
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