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Page Type Page Title General About Us General COVID-19 Update - We Are Open General Comments General Conflict Minerals General Contact Us General Copyright and Disclaimer Notice General Directions General Frequently Asked Questions General IPC Certified Technicians General IPC Member General Newsletter Subscription General Privacy Policy General REACH General RoHS General Search General System Security Policy General eBilling Request Form Services BGA Component Reballing Services BGA Component Rework Services BGA Component Site Modification Services Base Board Repair and Rework Services Circuitry and Plated Hole Repair Services Coating and Marking Rework Services Component Rework Services Component Salvage Services Component Tinning Services Services Engineering Change Services Services Gold Edge Contact Plating Services Inspection Services Services Keysight Adapter Rework Services SMT/BGA Pad Repair Services Terms, Prices, and Delivery Guides 1.0 Foreword Guides 2.0 Basic Procedures Guides 2.1 Handling Electronic Assemblies Guides 2.2 Cleaning Guides 2.2.1 Cleaning, Local Guides 2.2.2 Cleaning, Aqueous Batch Process Guides 2.3.1 Coating Removal, Identification of Coating Guides 2.3.2 Coating Removal, Solvent Method Guides 2.3.3 Coating Removal, Peeling Method Guides 2.3.4 Coating Removal, Thermal Method Guides 2.3.5 Coating Removal, Grinding/Scraping Method Guides 2.3.6 Coating Removal, Micro Blasting Method Guides 2.4.1 Coating Replacement, Solder Mask Guides 2.4.2 Coating Replacement, Conformal Coating, Encapsulant Guides 2.4.3 Coating Replacement, Solder Mask, BGA Locations Guides 2.5 Baking and Preheating Guides 2.6.1 Legend/Marking, Stamping Method Guides 2.6.2 Legend Marking, Hand Lettering Method Guides 2.6.3 Legend Marking, Stencil Method Guides 2.7 Epoxy Mixing and Handling Guides 3.0 Base Board Procedures Guides 3.1 Delamination/Blister Repair, Injection Method Guides 3.2 Bow and Twist Repair Guides 3.3.1 Hole Repair, Epoxy Method Guides 3.3.2 Hole Repair, Transplant Method Guides 3.4.1 Key and Slot Repair, Epoxy Method Guides 3.4.2 Key and Slot Repair, Transplant Method Guides 3.5.1 Base Material Repair, Epoxy Method Guides 3.5.2 Base Material Repair, Area Transplant Method Guides 3.5.3 Base Material Repair, Edge Transplant Method Guides 4.0 Conductor Procedures Guides 4.1.1 Lifted Conductor Repair, Epoxy Method Guides 4.1.2 Lifted Conductor Repair, Film Adhesive Method Guides 4.2.1 Conductor Repair, Foil Jumper, Epoxy Method Guides 4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method Guides 4.2.3 Conductor Repair, Welding Method Guides 4.2.4 Conductor Repair, Surface Wire Method Guides 4.2.5 Conductor Repair, Through Board Wire Method Guides 4.2.6 Conductor Repair, Inner Layer Method Guides 4.2.7 Conductor Repair, Surface Plane, Film Adhesive Method Guides 4.3.1 Circuit Cut, Surface Circuits Guides 4.3.2 Circuit Cut, Inner Layer Circuits Guides 4.3.3 Deleting Inner Layer Connection at a Plated Hole, Drill Through Guides 4.3.4 Deleting Inner Layer Connection at a Plated Hole, Spoke Cut Method Guides 4.4.1 Lifted Land Repair, Epoxy Seal Method Guides 4.4.2 Lifted Land Repair, Film Adhesive Method Guides 4.5.1 Land Repair, Epoxy Method Guides 4.5.2 Land Repair, Film Adhesive Method Guides 4.6.1 Edge Contact Repair, Epoxy Method Guides 4.6.2 Edge Contact Repair, Film Adhesive Method Guides 4.6.3 Edge Contact Repair/Rework, Plating Method Guides 4.7.1 Surface Mount Pad Repair, Epoxy Method Guides 4.7.2 Surface Mount Pad Repair, Film Adhesive Method Guides 4.7.3 Surface Mount, BGA Pad Repair, Film Adhesive Method Guides 4.7.4 Surface Mount, BGA Pad with Integral Via Repair Guides 4.7.5 Surface Mount, BGA Pad with Integral Via Repair Circuit Extension Method Guides 5.0 Plated Hole Procedures Guides 5.1 Plated Hole Repair, No Inner Layer Connection Guides 5.2 Plated Hole Repair, Double Wall Method Guides 5.3 Plated Hole Repair, Inner Layer Connection Guides 6.0 Jumper Wire and Component Modification Procedures Guides 6.1 Jumper Wires Guides 6.2.1 Jumper Wires, BGA Components, Circuit Track Method Guides 6.2.2 Jumper Wires, BGA Components, Through Board Method Guides 6.3 Component Modifications and Additions Guides 6.4 Component Lead Cutting and Lifting Guides 7.0 Soldering Procedures Guides 7.1.1 Soldering Basics Guides 7.1.2 Preparation For Soldering And Component Removal Guides 7.1.3 Solder Joint Acceptance Criteria Guides 7.2.1 Soldering Through Hole Components, Point To Point Method Guides 7.2.2 Soldering Through Hole Components, Solder Fountain Method Guides 7.3.1 Soldering Surface Mount Chip Components, Point To Point Method Guides 7.3.2 Soldering Surface Mount Chip Components, Hot Gas Method Guides 7.4.1 Soldering Surface Mount J Lead Components Point To Point Method Guides 7.4.2 Soldering Surface Mount J Lead Components Continuous Flow Method Guides 7.4.3 Soldering Surface Mount J Lead Components Hot Gas Method Guides 7.5.1 Soldering Surface Mount Gull Wing Components, Point To Point Method Guides 7.5.2 Soldering Surface Mount Gull Wing Components, Continuous Flow Method Guides 7.5.3 Soldering Surface Mount Gull Wing Components Hot Gas Method Guides 8.0 Component Rework Procedures Guides 8.1.1 Component Removal, Through Hole Components, Vacuum Method Guides 8.1.2 Component Removal, Through Hole Components, Solder Fountain Method Guides 8.2.1 Component Removal, Surface Mount Chip Components, Forked Tip Method Guides 8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method Guides 8.3.1 Component Removal, Surface Mount J Lead Components, Conduction Method Guides 8.3.2 Component Removal, Surface Mount J Lead Components, Hot Gas/Air Method Guides 8.4.1 Component Removal, Surface Mount Gull Wing Components, Conduction Method Guides 8.4.2 Component Removal, Surface Mount Gull Wing Components, Hot Gas/Air Method Guides 9.0 BGA Component Rework Procedures Guides 9.1.1 BGA Component Rework Process Flow Guides 9.1.2 BGA Component Rework Inspection Guides 9.1.3 BGA Component Reball Inspection Guides 9.2.1 BGA Component Rework Profile Development, Standard Method Guides 9.2.2 BGA Component Rework Profile Development, Smart Track Method Guides 9.3.1 BGA Component Rework Guides 9.4.1 BGA Component Reballing, Braid Ball Removal, Mini-Oven Attachment Method Guides 9.4.2 BGA Component Reballing, Braid Ball Removal, Reflow Oven Attachment Method Guides 9.4.3 BGA Component Reballing, Robotic Ball Removal, Mini-Oven Attachment Method Guides 9.4.4 BGA Component Reballing, Robotic Ball Removal, Reflow Oven Attachment Method Guides 9.5.1 BGA Component Removal, Machining Method Blogs 11 Rules for Circuit Board Mods Blogs 3 Options for BGA Rework Blogs 4 Techniques for Removing Solder Mask Blogs 6 Common Mistakes of BGA Rework Blogs A Solution for Broken Pin Repair Blogs Alternative to Dead Bug Rework Blogs Are Your BGA Rework Operators Experts? Blogs BGA Component Site Modification - Is It Possible? Blogs BGA Conductor Path Re-design Blogs Backplane X-ray Analysis Blogs Base Board Burn Repair - How and Why Blogs Beyond Repair... Think Again Blogs Big Time Damaged Conductor Repair Blogs Case of the Missing SMT Pads Blogs Challenging Connector Rework Blogs Challenging Gold Contact Repair Blogs Changing a Conductor Path at a BGA Site Blogs Conductor Repair - When Appearance Counts Blogs Converting Tin/Lead BGA Pads to Gold Plated Blogs Cutting Circuits and Conductors Blogs Damaged Mounting Hole Repair Blogs Edge Milling to Reduce Board Thickness Blogs Exploding Solder Balls Blogs Flash Memory Card Rescue Blogs How Reliable Is Your Rework? Blogs How To Restore Damaged Gold Edge Contacts Blogs How To Restore Missing Internal Layer Connections Blogs How to Fix Press-in Fastener Damage Blogs How to Select the Right Eyelet for Plated Hole Repair Blogs How to Use a Solder Fountain Blogs Inner Layer Conductor Modification Blogs Isolating a Plated Hole From Ground Blogs Jumper Wire Nightmare Blogs Keysight Technologies Adapter Rework Blogs Method for Adding A Via Hole Blogs Options for Gold Contact Rework Blogs Potted QFP Rework Challenge Blogs Preventing BGA Component Warp During Rework Blogs Questions to Ask When Salvaging Components Blogs Review of Hot Air Component Rework for SMT Components Blogs Rework Option Eliminates Jumper Wires Blogs Rework for Internal Conductor Mismatch Blogs Rework for Missing Ground Connections Blogs Rework for Pad and Component Mismatch Blogs Reworking Internal Connection at a Via Hole Blogs Scrapes and Breaks Repaired Blogs Solder Joint Opens - What To Do? Blogs Solder Mask Rework at a BGA Site Blogs Solder Mask Touch-Up At BGA Sites Blogs Soldering Long Gold Plated Pins Blogs Solution for BGA Footprint Mismatch Blogs Ten Rules for Jumper Wires Blogs The Most Essential Tool for Repair Techs Blogs The Repair Technician Hall Of Fame Blogs Tips For Through Hole Connector Rework Blogs Tips and Tricks for Successful Rework Blogs Tips for Rework of Large Scale BGA Components Blogs Trimming Conductors In Very Tight Places Blogs Unique Ground Plane Transplant Repair Blogs X-Ray Finds Shorts in Drilled Holes Blogs X-Ray System Eye Opener