Circuit Technology Center
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General About Us
General COVID-19 Update - We Are Open
General Comments
General Conflict Minerals
General Contact Us
General Copyright and Disclaimer Notice
General Directions
General Frequently Asked Questions
General IPC Certified Technicians
General IPC Member
General Newsletter Subscription
General Privacy Policy
General REACH
General RoHS
General Search
General eBilling Request Form
Services BGA Component Reballing
Services BGA Component Rework
Services BGA Component Site Modification
Services Base Board Repair and Rework
Services Circuitry and Plated Hole Repair
Services Coating and Marking Rework
Services Component Rework
Services Component Salvage
Services Component Tinning Services
Services Engineering Change Services
Services Gold Edge Contact Plating
Services Inspection Services
Services Keysight Adapter Rework
Services SMT/BGA Pad Repair
Services Terms, Prices, and Delivery
Guides 1.0 Foreword
Guides 2.0 Basic Procedures
Guides 2.1 Handling Electronic Assemblies
Guides 2.2 Cleaning
Guides 2.2.1 Cleaning, Local
Guides 2.2.2 Cleaning, Aqueous Batch Process
Guides 2.3.1 Coating Removal, Identification of Coating
Guides 2.3.2 Coating Removal, Solvent Method
Guides 2.3.3 Coating Removal, Peeling Method
Guides 2.3.4 Coating Removal, Thermal Method
Guides 2.3.5 Coating Removal, Grinding/Scraping Method
Guides 2.3.6 Coating Removal, Micro Blasting Method
Guides 2.4.1 Coating Replacement, Solder Mask
Guides 2.4.2 Coating Replacement, Conformal Coating, Encapsulant
Guides 2.4.3 Coating Replacement, Solder Mask, BGA Locations
Guides 2.5 Baking and Preheating
Guides 2.6.1 Legend/Marking, Stamping Method
Guides 2.6.2 Legend Marking, Hand Lettering Method
Guides 2.6.3 Legend Marking, Stencil Method
Guides 2.7 Epoxy Mixing and Handling
Guides 3.0 Base Board Procedures
Guides 3.1 Delamination/Blister Repair, Injection Method
Guides 3.2 Bow and Twist Repair
Guides 3.3.1 Hole Repair, Epoxy Method
Guides 3.3.2 Hole Repair, Transplant Method
Guides 3.4.1 Key and Slot Repair, Epoxy Method
Guides 3.4.2 Key and Slot Repair, Transplant Method
Guides 3.5.1 Base Material Repair, Epoxy Method
Guides 3.5.2 Base Material Repair, Area Transplant Method
Guides 3.5.3 Base Material Repair, Edge Transplant Method
Guides 4.0 Conductor Procedures
Guides 4.1.1 Lifted Conductor Repair, Epoxy Method
Guides 4.1.2 Lifted Conductor Repair, Film Adhesive Method
Guides 4.2.1 Conductor Repair, Foil Jumper, Epoxy Method
Guides 4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method
Guides 4.2.3 Conductor Repair, Welding Method
Guides 4.2.4 Conductor Repair, Surface Wire Method
Guides 4.2.5 Conductor Repair, Through Board Wire Method
Guides 4.2.6 Conductor Repair, Inner Layer Method
Guides 4.2.7 Conductor Repair, Surface Plane, Film Adhesive Method
Guides 4.3.1 Circuit Cut, Surface Circuits
Guides 4.3.2 Circuit Cut, Inner Layer Circuits
Guides 4.3.3 Deleting Inner Layer Connection at a Plated Hole, Drill Through
Guides 4.3.4 Deleting Inner Layer Connection at a Plated Hole, Spoke Cut Method
Guides 4.4.1 Lifted Land Repair, Epoxy Seal Method
Guides 4.4.2 Lifted Land Repair, Film Adhesive Method
Guides 4.5.1 Land Repair, Epoxy Method
Guides 4.5.2 Land Repair, Film Adhesive Method
Guides 4.6.1 Edge Contact Repair, Epoxy Method
Guides 4.6.2 Edge Contact Repair, Film Adhesive Method
Guides 4.6.3 Edge Contact Repair/Rework, Plating Method
Guides 4.7.1 Surface Mount Pad Repair, Epoxy Method
Guides 4.7.2 Surface Mount Pad Repair, Film Adhesive Method
Guides 4.7.3 Surface Mount, BGA Pad Repair, Film Adhesive Method
Guides 4.7.4 Surface Mount, BGA Pad with Integral Via Repair
Guides 4.7.5 Surface Mount, BGA Pad with Integral Via Repair Circuit Extension Method
Guides 5.0 Plated Hole Procedures
Guides 5.1 Plated Hole Repair, No Inner Layer Connection
Guides 5.2 Plated Hole Repair, Double Wall Method
Guides 5.3 Plated Hole Repair, Inner Layer Connection
Guides 6.0 Jumper Wire and Component Modification Procedures
Guides 6.1 Jumper Wires
Guides 6.2.1 Jumper Wires, BGA Components, Circuit Track Method
Guides 6.2.2 Jumper Wires, BGA Components, Through Board Method
Guides 6.3 Component Modifications and Additions
Guides 6.4 Component Lead Cutting and Lifting
Guides 7.0 Soldering Procedures
Guides 7.1.1 Soldering Basics
Guides 7.1.2 Preparation For Soldering And Component Removal
Guides 7.1.3 Solder Joint Acceptance Criteria
Guides 7.2.1 Soldering Through Hole Components, Point To Point Method
Guides 7.2.2 Soldering Through Hole Components, Solder Fountain Method
Guides 7.3.1 Soldering Surface Mount Chip Components, Point To Point Method
Guides 7.3.2 Soldering Surface Mount Chip Components, Hot Gas Method
Guides 7.4.1 Soldering Surface Mount J Lead Components Point To Point Method
Guides 7.4.2 Soldering Surface Mount J Lead Components Continuous Flow Method
Guides 7.4.3 Soldering Surface Mount J Lead Components Hot Gas Method
Guides 7.5.1 Soldering Surface Mount Gull Wing Components, Point To Point Method
Guides 7.5.2 Soldering Surface Mount Gull Wing Components, Continuous Flow Method
Guides 7.5.3 Soldering Surface Mount Gull Wing Components Hot Gas Method
Guides 8.0 Component Rework Procedures
Guides 8.1.1 Component Removal, Through Hole Components, Vacuum Method
Guides 8.1.2 Component Removal, Through Hole Components, Solder Fountain Method
Guides 8.2.1 Component Removal, Surface Mount Chip Components, Forked Tip Method
Guides 8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method
Guides 8.3.1 Component Removal, Surface Mount J Lead Components, Conduction Method
Guides 8.3.2 Component Removal, Surface Mount J Lead Components, Hot Gas/Air Method
Guides 8.4.1 Component Removal, Surface Mount Gull Wing Components, Conduction Method
Guides 8.4.2 Component Removal, Surface Mount Gull Wing Components, Hot Gas/Air Method
Guides 9.0 BGA Component Rework Procedures
Guides 9.1.1 BGA Component Rework Process Flow
Guides 9.1.2 BGA Component Rework Inspection
Guides 9.1.3 BGA Component Reball Inspection
Guides 9.2.1 BGA Component Rework Profile Development, Standard Method
Guides 9.2.2 BGA Component Rework Profile Development, Smart Track Method
Guides 9.3.1 BGA Component Rework
Guides 9.4.1 BGA Component Reballing, Braid Ball Removal, Mini-Oven Attachment Method
Guides 9.4.2 BGA Component Reballing, Braid Ball Removal, Reflow Oven Attachment Method
Guides 9.4.3 BGA Component Reballing, Robotic Ball Removal, Mini-Oven Attachment Method
Guides 9.4.4 BGA Component Reballing, Robotic Ball Removal, Reflow Oven Attachment Method
Guides 9.5.1 BGA Component Removal, Machining Method
Blogs 11 Rules for Circuit Board Mods
Blogs 3 Options for BGA Rework
Blogs 4 Techniques for Removing Solder Mask
Blogs 6 Common Mistakes of BGA Rework
Blogs A Solution for Broken Pin Repair
Blogs Alternative to Dead Bug Rework
Blogs Are Your BGA Rework Operators Experts?
Blogs BGA Component Site Modification - Is It Possible?
Blogs BGA Conductor Path Re-design
Blogs Backplane X-ray Analysis
Blogs Base Board Burn Repair - How and Why
Blogs Beyond Repair... Think Again
Blogs Big Time Damaged Conductor Repair
Blogs Case of the Missing SMT Pads
Blogs Challenging Connector Rework
Blogs Challenging Gold Contact Repair
Blogs Changing a Conductor Path at a BGA Site
Blogs Conductor Repair - When Appearance Counts
Blogs Converting Tin/Lead BGA Pads to Gold Plated
Blogs Cutting Circuits and Conductors
Blogs Damaged Mounting Hole Repair
Blogs Edge Milling to Reduce Board Thickness
Blogs Exploding Solder Balls
Blogs Flash Memory Card Rescue
Blogs How Reliable Is Your Rework?
Blogs How To Restore Damaged Gold Edge Contacts
Blogs How To Restore Missing Internal Layer Connections
Blogs How to Fix Press-in Fastener Damage
Blogs How to Select the Right Eyelet for Plated Hole Repair
Blogs How to Use a Solder Fountain
Blogs Inner Layer Conductor Modification
Blogs Isolating a Plated Hole From Ground
Blogs Jumper Wire Nightmare
Blogs Keysight Technologies Adapter Rework
Blogs Method for Adding A Via Hole
Blogs Options for Gold Contact Rework
Blogs Potted QFP Rework Challenge
Blogs Preventing BGA Component Warp During Rework
Blogs Questions to Ask When Salvaging Components
Blogs Review of Hot Air Component Rework for SMT Components
Blogs Rework Option Eliminates Jumper Wires
Blogs Rework for Internal Conductor Mismatch
Blogs Rework for Missing Ground Connections
Blogs Rework for Pad and Component Mismatch
Blogs Reworking Internal Connection at a Via Hole
Blogs Scrapes and Breaks Repaired
Blogs Solder Joint Opens - What To Do?
Blogs Solder Mask Rework at a BGA Site
Blogs Solder Mask Touch-Up At BGA Sites
Blogs Soldering Long Gold Plated Pins
Blogs Solution for BGA Footprint Mismatch
Blogs Ten Rules for Jumper Wires
Blogs The Most Essential Tool for Repair Techs
Blogs The Repair Technician Hall Of Fame
Blogs Tips For Through Hole Connector Rework
Blogs Tips and Tricks for Successful Rework
Blogs Tips for Rework of Large Scale BGA Components
Blogs Trimming Conductors In Very Tight Places
Blogs Unique Ground Plane Transplant Repair
Blogs X-Ray Finds Shorts in Drilled Holes
Blogs X-Ray System Eye Opener