Surgeon grade rework and repair, by the book and guaranteed.®
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Component Tinning Services

Our tinning or re-tinning services are used to change the metallic finish of component leads or pads, most commonly to change leads or pads with a lead-free solder finish to a leaded solder finish for tin whisker elimination. Tinning is also used for gold plating removal or mitigation.

We use a fully programmable robotic hot solder dip machines (RHSD) to precisely control dip depth, dwell times and temperatures for processing of components in full compliance with GEIA-0006 standards. When required, 100% removal of tin finish is replaced with tin-lead (Sn63/Pb37) for tin whisker mitigation.

Gold removal/mitigation is completed in accordance with J-Std-001 specifications. We use batch wash systems for post process cleaning, provide tape and reel services, component MSL bake and packaging and pre/post process testing as needed.

Learn About Our Component Reballing Services
  • We use a robotic hot solder dip system to precisely control dip depth, dwell times and temperatures.
Purchase Order / Quote Request Form
To place your purchase order or quote request by phone call 978-374-5000. You may also place your purchase order or quote request using the form below.

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Use the form on our Contact Us page, or give us a call at 978-374-5000.

BGA Component Reballing

Including BGA component reball service to replace lead-free solder balls with leaded solder balls for high-rel applications.

BGA Component Rework

Including BGA rework, BGA component x-ray services, repair of damaged BGA pads and repair of BGA solder mask damage.

BGA Component Site Modification

This unique procedure uses copper ribbon that fits under the BGA component to provide an electrical path for modification.

Base Board Repair and Rework

Including repair damaged circuit base board laminate, delamination, warp, hole damage, burns, and solder mask damage.

Circuitry and Plated Hole Repair

Including repair of damage to circuitry and plated holes, plus repair of damaged plated holes with inner layer connections.

Coating and Marking Rework

Including rework of conformal coatings and solder mask, and repair of circuit board legend and markings.

Component Rework

Including removal or replacement of surface mount and through hole components, connectors and more.

Component Salvage

Includes removal and salvage of BGA components, surface mount components, connectors and many other component types.

Component Tinning Services

Our tinning or re-tinning services are used to change component leads and pads from one metallic finish to another.

Engineering Change Services

Including ECO, engineering changes, upgrades, modifications, jumper wires, circuit cuts, and other modification procedures.

Gold Edge Contact Plating

Including repair and replating of solder contaminated gold contacts, scratched gold contacts and worn gold contacts.

Inspection Services

Including BGA component and circuit board x-ray inspection services using high-end Dage inspection systems.

Keysight Technologies Adapter Rework

This page explains the process for installing Keysight Technologies DDR2 DRAM BGA Probes onto circuit boards.

Order Tracking Form

Form to send circuit boards to us for repair and rework.

Quote Request

Use this form to request a quote for circuit board repair, rework, modification services.

SMT/BGA Pad Repair

Including repair of damaged, lifted or missing surface mount pads, BGA pads, and BGA pads with with integral via connections.

Terms, Prices, and Delivery

Service terms, prices, and delivery information covering our circuit board repair and rework services.
Customer Comments
"The technicians at Circuit Technology Center have proven once again that they can handle anything that we throw at them. Thanks again for getting us out of a jam."
A.C. Derby, England
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