Circuit Board Rework and Repair Services
Component Tinning and Reballing
GENERAL SERVICES GUIDES PRODUCTS
March 22, 2017
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For this repair we're looking at the process to correct base board damage, or to correct a design error at an ejector mounting handle location, but this procedure can be used to repair any non-plated hole. The ejector handle is often held in place by a roll pin. When the ejector handle is retracted, the lever action will be used to press in, or eject the circuit board into, or out of a connector, or card cage. Standard circuit board construction will easily withstand this stress, but what about a modified, or repaired ...
Feature Story
Ask the Experts
During a BGA remove and replace process, is it preferable to use a mini stencil and re-deposit solder paste on the site? Or is the fact that the pads are already tinned enough to produce a quality reflow ...
Ask the Experts
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The lead-free solder does not wet metal surfaces as well as tin-lead metallurgy. This narrows down the process window for lead-free solder ...
Technical Library
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When gold edge contacts can become worn, damaged or contaminated by solder, they must be either repaired and restored, or replaced. Both procedures result in a high conformance level repair that is reliable and long lasting. Re-plating is a reliable, yet complicated, process requiring a considerable amount of setup, special chemistry that is hazardous and, in general, a high level of operator skill and training. Replacing the contact is faster and simpler, lacking the setup and chemistry of re-plating, but ...
Feature Story
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Technology Briefing
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