| May 23, 2012
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This re-design centered around a 676 ball BGA component. A total of 23 of the balls on the BGA were not connected where they needed to be.
The only viable solution involved re-routing. That's a significant re-design under any circumstances. It would have been easier if the pads that required re-routing were on the perimeter of the BGA layout, but such was not the case.
The newly routed pads had to extend from the center of the component to outside of the package footprint so that wires could be added to the newly placed pattern of ...
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Recently a customer was in a tough bind regarding defective plating. They manufactured a massive back-plane over four feet long and two feet wide. The board is nearly one half inch thick and plated throughout with gold.
These boards contain thousands of surface mount pads and inevitably there are one or two that have issues. On occasion the issues are very deep voids or scratches in the pads.
There are a number of options for handling voids in plating surfaces and they are detailed in this ...
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Even in today's high tech world, there are still thousands of circuit boards being used that were (and are still being) made with through hole technology.
Experience tells me that many of these through hole circuit boards will need a plated hole repaired at some point. Procedure 5.1 Plated Hole Repair may be the one that will save your irreplaceable electronic assembly.
As good as this procedure is, there is one section that may cause even the most experienced repair technician some head scratching; it is how to select the right eyelet. I direct you to "eyelet selection criteria" section of ...
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Trivia
See the answer below.
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Quote of the Week
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