| September 29, 2009
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In the electronics industry, gold plating is ancient technology and the problems encountered in plating are just as ancient. Unfortunately that doesn't make them any easier to solve. Things are always changing in this business, getting smaller, more complicated and sometimes you have to be innovative to solve an unusual problem.
Recently a customer was in a tough bind regarding defective plating. They manufactured a massive backplane over four feet long and two feet wide. The board is nearly one half inch thick and plated throughout with gold ...
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You have a new board and the BGA component doesn't fit the board footprint. Is this a nightmare of a problem? It is one we see at Circuit Technology Center every other month or so.
It's seems to be a problem faced by OEM’s early in the development cycle. In this actual example the flagship product an OEM is working on has gotten to the post assembly test phase and there's a hang-up ...
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Trivia
See the answer below.
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Quote of the Week
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