| December 15, 2009
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When surface-mount components started to take over, edging out through-hole components, a number of hot air-based rework systems appeared on the scene. Many were large, some small, but all had various means of delivering hot air to the component with varying degrees of process control.
Despite their diversity, they all had one thing in common -- they were fine for removing components from a circuit board, but none were particularly good at ...
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Solder mask has one primary purpose at a BGA site, and that is to isolate solder wetting to a specific area, e.g., the BGA pad, so that a good solder joint will be formed.
This solder mask usually isolates the pad from the conductor, or from the track leading to a via or plated hole. Sometimes there is only a thin "dam" of mask between the pad area and exposed track and hole.
This dam or masking is delicate, and easily damaged or dislodged during rework. If it isn't repaired, the result ...
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While working with an extremely expensive pin grid array style component, a customer reported that they broke off a pin at the base near the component body.
The shoulder of the pin was approximately twice the diameter of the main pin body and approximately .50" (12.7 mm) in length. Is it possible to repair damage to a component like ...
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Trivia
See the answer below.
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Quote of the Week
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