Advanced X-Ray Inspection Services

September 19, 2008

Dage XD7600 XiDat X-ray System

Circuit Technology Center has improved upon the x-ray inspection services provided with the addition of a new Dage XD7600 XiDat X-ray system. This new system provides the highest resolution in the industry, allowing Circuit Technology Center to enhance their BGA and QFN rework services with very detailed inspection of voids, opens and shorts and other circuit board issues.

Every circuit board processed for BGA rework is carefully inspected with the state-of-the-art Dage X-Ray System. The x-ray inspection process is a critical step in the BGA rework process.

X-ray systems must be able to provide the highest resolution, magnification and high contrast for an accurate reading. The Dage XD7600 is a top of the line system that provides highly detailed, real time x-ray images for failure analysis.

X-ray image of BGA ball voids

Extensive grayscale definition and oblique angle views up to 70 degrees over the entire inspection area result in the detail that is necessary for proper diagnosis of circuit board related issues. The Dage XD7600 features 250 nm feature recognition, AXIS – Active Imaging Stabilization and precise XiDAT 2.0 Imaging Scan.

For more information on Circuit Technology Center’s x-ray inspection services visit http://www.circuitrework.com/services/xray.shtml.

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