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General About Us
General Comments
General Conflict Minerals
General Contact Us
General Copyright and Disclaimer Notice
General Directions
General Frequently Asked Questions
General Newsletter Subscription
General Privacy Policy
General REACH
General RoHS
General eBilling Request Form
Services BGA Reballing Services
Services BGA Rework and Repair Services
Services Base Board Repair and Rework
Services Circuit Board Repair and Rework Services Overview
Services Circuitry and Plated Hole Repair
Services Coating and Marking Rework
Services Component Salvage
Services ECO, Upgrade and Modification Services
Services Gold Edge Contact Rework and Repair
Services Inspection Services
Services Order Tracking Form
Services SMT and Through Hole Component Rework
Services Service Terms, Prices, and Delivery Information
Services Services Quote Request
Services Surface Mount and BGA Pad Repair
Guides 1.0 Foreword
Guides 2.0 Basic Procedures
Guides 2.1 Handling Electronic Assemblies
Guides 2.2 Cleaning
Guides 2.2.1 Cleaning, Local
Guides 2.2.2 Cleaning, Aqueous Batch Process
Guides 2.3.1 Coating Removal, Identification of Coating
Guides 2.3.2 Coating Removal, Solvent Method
Guides 2.3.3 Coating Removal, Peeling Method
Guides 2.3.4 Coating Removal, Thermal Method
Guides 2.3.5 Coating Removal, Grinding/Scraping Method
Guides 2.3.6 Coating Removal, Micro Blasting Method
Guides 2.4.1 Coating Replacement, Solder Mask
Guides 2.4.2 Coating Replacement, Conformal Coating, Encapsulant
Guides 2.4.3 Coating Replacement, Solder Mask, BGA Locations
Guides 2.5 Baking and Preheating
Guides 2.6.1 Legend/Marking, Stamping Method
Guides 2.6.2 Legend Marking, Hand Lettering Method
Guides 2.6.3 Legend Marking, Stencil Method
Guides 2.7 Epoxy Mixing and Handling
Guides 3.0 Base Board Procedures
Guides 3.1 Delamination/Blister Repair, Injection Method
Guides 3.2 Bow and Twist Repair
Guides 3.3.1 Hole Repair, Epoxy Method
Guides 3.3.2 Hole Repair, Transplant Method
Guides 3.4.1 Key and Slot Repair, Epoxy Method
Guides 3.4.2 Key and Slot Repair, Transplant Method
Guides 3.5.1 Base Material Repair, Epoxy Method
Guides 3.5.2 Base Material Repair, Area Transplant Method
Guides 3.5.3 Base Material Repair, Edge Transplant Method
Guides 4.0 Conductor Procedures
Guides 4.1.1 Lifted Conductor Repair, Epoxy Method
Guides 4.1.2 Lifted Conductor Repair, Film Adhesive Method
Guides 4.2.1 Conductor Repair, Foil Jumper, Epoxy Method
Guides 4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method
Guides 4.2.3 Conductor Repair, Welding Method
Guides 4.2.4 Conductor Repair, Surface Wire Method
Guides 4.2.5 Conductor Repair, Through Board Wire Method
Guides 4.2.6 Conductor Repair, Inner Layer Method
Guides 4.2.7 Conductor Repair, Surface Plane, Film Adhesive Method
Guides 4.3.1 Circuit Cut, Surface Circuits
Guides 4.3.2 Circuit Cut, Inner Layer Circuits
Guides 4.3.3 Deleting Inner Layer Connection at a Plated Hole, Drill Through
Guides 4.3.4 Deleting Inner Layer Connection at a Plated Hole, Spoke Cut Method
Guides 4.4.1 Lifted Land Repair, Epoxy Seal Method
Guides 4.4.2 Lifted Land Repair, Film Adhesive Method
Guides 4.5.1 Land Repair, Epoxy Method
Guides 4.5.2 Land Repair, Film Adhesive Method
Guides 4.6.1 Edge Contact Repair, Epoxy Method
Guides 4.6.2 Edge Contact Repair, Film Adhesive Method
Guides 4.6.3 Edge Contact Repair/Rework, Plating Method
Guides 4.7.1 Surface Mount Pad Repair, Epoxy Method
Guides 4.7.2 Surface Mount Pad Repair, Film Adhesive Method
Guides 4.7.3 Surface Mount, BGA Pad Repair, Film Adhesive Method
Guides 4.7.4 Surface Mount, BGA Pad with Integral Via Repair
Guides 4.7.5 Surface Mount, BGA Pad with Integral Via Repair Circuit Extension Method
Guides 5.0 Plated Hole Procedures
Guides 5.1 Plated Hole Repair, No Inner Layer Connection
Guides 5.2 Plated Hole Repair, Double Wall Method
Guides 5.3 Plated Hole Repair, Inner Layer Connection
Guides 6.0 Jumper Wire and Component Modification Procedures
Guides 6.1 Jumper Wires
Guides 6.2.1 Jumper Wires, BGA Components, Circuit Track Method
Guides 6.2.2 Jumper Wires, BGA Components, Through Board Method
Guides 6.3 Component Modifications and Additions
Guides 6.4 Component Lead Cutting and Lifting
Guides 7.0 Soldering Procedures
Guides 7.1.1 Soldering Basics
Guides 7.1.2 Preparation For Soldering And Component Removal
Guides 7.1.3 Solder Joint Acceptance Criteria
Guides 7.2.1 Soldering Through Hole Components, Point To Point Method
Guides 7.2.2 Soldering Through Hole Components, Solder Fountain Method
Guides 7.3.1 Soldering Surface Mount Chip Components, Point To Point Method
Guides 7.3.2 Soldering Surface Mount Chip Components, Hot Gas Method
Guides 7.4.1 Soldering Surface Mount J Lead Components Point To Point Method
Guides 7.4.2 Soldering Surface Mount J Lead Components Continuous Flow Method
Guides 7.4.3 Soldering Surface Mount J Lead Components Hot Gas Method
Guides 7.5.1 Soldering Surface Mount Gull Wing Components, Point To Point Method
Guides 7.5.2 Soldering Surface Mount Gull Wing Components, Continuous Flow Method
Guides 7.5.3 Soldering Surface Mount Gull Wing Components Hot Gas Method
Guides 8.0 Component Rework Procedures
Guides 8.1.1 Component Removal, Through Hole Components, Vacuum Method
Guides 8.1.2 Component Removal, Through Hole Components, Solder Fountain Method
Guides 8.2.1 Component Removal, Surface Mount Chip Components, Forked Tip Method
Guides 8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method
Guides 8.3.1 Component Removal, Surface Mount J Lead Components, Conduction Method
Guides 8.3.2 Component Removal, Surface Mount J Lead Components, Hot Gas/Air Method
Guides 8.4.1 Component Removal, Surface Mount Gull Wing Components, Conduction Method
Guides 8.4.2 Component Removal, Surface Mount Gull Wing Components, Hot Gas/Air Method
Guides 9.0 BGA Component Rework Procedures
Guides 9.1.1 BGA Component Rework Process Flow
Guides 9.1.2 BGA Component Rework Inspection
Guides 9.2.1 BGA Component Rework Profile Development, Standard Method
Guides 9.2.2 BGA Component Rework Profile Development, Smart Track Method
Guides 9.3.1 BGA Component Rework
Guides 9.4.1 BGA Component Reballing, Fixture Method
Features 11 Rules for Circuit Board Mods
Features 3 Options for BGA Rework
Features 4 Techniques for Removing Solder Mask
Features 6 Common Mistakes of BGA Rework
Features A Solution for Broken Pin Repair
Features Adding A Via Hole
Features Alternative to Dead Bug Rework
Features Are Your BGA Rework Operators Competent?
Features BGA Component Site Modification - Is It Possible?
Features BGA Conductor Path Re-design
Features Backplane X-ray Analysis
Features Base Board Burn Repair - How and Why
Features Beyond Repair... Think Again
Features Big Time Damaged Conductor Repair
Features Case of the Missing SMT Pads
Features Challenging Connector Rework
Features Challenging Gold Contact Repair
Features Changing a Conductor Path at a BGA Site
Features Conductor Repair - When Appearance Counts
Features Converting Tin/Lead BGA Pads to Gold Plated
Features Cutting Circuits and Conductors
Features Damaged Mounting Hole Repair
Features Edge Milling to Reduce Board Thickness
Features Exploding Solder Balls
Features Flash Memory Card Rescue
Features How Reliable Is Your Rework?
Features How To Restore Missing Internal Layer Connections
Features How to Fix Press-in Fastener Damage
Features How to Select the Right Eyelet for Plated Hole Repair
Features How to Use a Solder Fountain
Features Inner Layer Conductor Modification
Features Isolating a Plated Hole From Ground
Features Jumper Wire Nightmare
Features Keysight Technologies Adapter Rework
Features Options for Gold Contact Rework
Features Potted QFP Rework Challenge
Features Preventing BGA Component Warp During Rework
Features Questions to Ask When Salvaging Components
Features Restoring Gold Edge Connectors
Features Review of Hot Air Component Rework
Features Rework Option Eliminates Jumper Wires
Features Rework for Internal Conductor Mismatch
Features Rework for Missing Ground Connections
Features Rework for Pad and Component Mismatch
Features Scrapes and Breaks Repaired
Features Solder Joint Opens - What To Do?
Features Solder Mask Rework at a BGA Site
Features Solder Mask Touch-Up At BGA Sites
Features Soldering Long Gold Plated Pins
Features Solution for BGA Footprint Mismatch
Features Ten Rules for Jumper Wires
Features The Most Essential Tool for Repair Techs
Features Tips For Connector Removal and Replacement
Features Tips and Tricks for Successful Rework
Features Tips for Rework of Large Scale BGA Components
Features Trimming Conductors In Very Tight Places
Features Unique Ground Plane Transplant Repair
Features X-Ray Finds Shorts in Drilled Holes
Features X-Ray System Eye Opener