Calibration Record CLR1061 Revision A  |   ECN200  |   Rev Date: Nov 1, 2001

TR-3C Bonding Press (CLR1061, S# 010S)
Written By: J. Ferry


Description
Used to thermally bond circuit frame pads, contact edges, and etches to PC Boards

Make/Model
Circuit Technology Center, Model TR-3C, S/N 010S

Calibration Interval
1 year

Next Calibration Due
Jan 30, 2009

Calibration Procedure
Refer to Bonding Press or TR-3 Calibration temperature and pressure procedure in file for specific instructions.

Calibration Log
Date Calibrated By Corrections
Aug 15, 2001 N. Arivella Passed
Aug 15, 2002 N. Arivella

Passed
15 Aug 2003  R. Barrett  Passed thermal, recalibrate for pressure by 10 Sep 2003. 
22 Sept. 2004  R. Barrett and E. farnham  Started Aug 18 but final press comparisons and checks dragged on due to vacations etc. 
Aug 2005  R. Barrett and E. Farnham  Passed 
 August, 9.2007  E. Farnham Bonding press has been removed from the floor due to slight malfunction. It will be reworked and returned to the floor when unt passes calibration requirements.
 Jan 9, 2008  R. Barrett  Passed thermal & pressure tests
     
     


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