Calibration Record CLR1059 Revision A  |   ECN200  |   Rev Date: Nov 1, 2001

TR-3C Bonding Press (CLR1059, S# 007S)
Written By: J. Ferry


Description
Used to thermally bond circuit frame pads, contact edges, and etches to PC Boards

Make/Model
Circuit Technology Center, Model TR-3C, S/N 007S

Calibration Interval
1 year

Next Calibration Due
Jan 30, 2009

Calibration Procedure
Refer to Bonding Press or TR-3 Calibration temperature and pressure procedure in file for specific instructions.

Calibration Log
Date Calibrated By Corrections
Aug 15, 2001 N. Arivella Passed
Aug 15, 2002 N. Arivella Unit passed thermal and pressure test requirements. The tool slide is loose. This will be addressed in September.
15 Aug 2003  R. Barrett  Passed thermal. Replace tool slide and recalibrate for pressure by 10 Sep 2003. 
22 Sept 2004  R. Barrett and E. Farnham Started Aug 18 but final press comparisons and checks dragged on due to vacations etc.
Aug 2005   R. Barrett and E. Farnham Passed 
 Aug. 24,2006  E. Farnham  passed thermal and pressure tests
 Jan 9, 2008  R. Barrett  Passed thermal & pressure tests
     
     


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