Description
Used to thermally bond circuit frame pads, contact edges, and etches to PC Boards
Make/Model
Circuit Technology Center, Model TR-3C, S/N 001S
Calibration Interval
1 year
Next Calibration Due
Jan 30, 2009
Calibration Procedure
Refer to Bonding Press or TR-3 Calibration temperature and pressure procedure in file for specific instructions.
Calibration Log
|
Date |
Calibrated By |
Corrections |
|
Aug 15, 2001 |
N. Arivella |
Unit was tagged "Out of Service" in July, 2001, physically removed from service, and set aside in the War Room. Unit did NOT pass thermal requirements. When all TR3C's were calibrated in August I removed it from service on ECN202. |
|
Aug 15, 2002 |
N. Arivella |
Evaluation indicated that unit required a new heater block assembly. It was repaired, calibrated and brought into service on 22 Aug 02. |
|
15 Aug 2003 |
R. Barrett |
Passed thermal and pressure. |
|
22 Sept 2004 |
R. Barrett and E. Farnham |
Passed. Started Aug 18 but final press comparisons and checks dragged on due to vacations etc. |
|
Aug 2005 |
R. Barrett and E. Farnham |
Passed |
|
Aug. 24, 2006 |
E. farnham |
Passed thermal and pressure tests |
|
Jan 9, 2008 |
B. Barrett |
Passed thermal & pressure test |
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Index
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